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公开(公告)号：USD1003327S1
公开(公告)日：2023-10-31
申请号：US29790740
申请日：2021-12-13
Applicant: HIWIN TECHNOLOGIES CORP.
Designer： Jonus Liu , Jheng-Fu Huang , Yi-Chan Tseng , Shou-Yang Huang
Abstract: FIG. 1 is a perspective view of a wafer aligner showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines show portions of a wafer aligner that form no part of claimed design.
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