公开(公告)号：US20230337362A1

公开(公告)日：2023-10-19

申请号：US18245633

申请日：2021-08-05

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hongbin SHI

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10984

Abstract: Embodiments of this application disclose an electronic component and an electronic device. The electronic component is disposed on a printed circuit board (PCB). The electronic component includes an electronic component body. The electronic component body is soldered to the PCB by using a connecting component. The connecting component is provided with at least one cushioning structure.

公开(公告)号：US20200343210A1

公开(公告)日：2020-10-29

申请号：US16958565

申请日：2017-12-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hongbin SHI ,  Zhuqiu WANG ,  Runqing YE ,  Haohui LONG

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L21/48 ,  H01L21/56

Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.