GRINDING METHOD USING NANOLAYER-LUBRICATED DIAMOND GRINDING WHEEL BASED ON SHOCK WAVE CAVITATION EFFECT

    公开(公告)号:US20230311272A1

    公开(公告)日:2023-10-05

    申请号:US18119297

    申请日:2023-03-09

    CPC classification number: B24B55/03 B24C5/08

    Abstract: The present invention provides a nanolayer-lubricated diamond grinding wheel grinding method based on a shock wave cavitation effect. In the method, after a gas pressure regulation valve is turned on, a shock wave generated by an acceleration tube pushes nanoparticles to move forward, and the nanoparticles are then accelerated by a small de Laval nozzle to acquire a high initial velocity. One wave source of a shock wave speed-increase module generates a high-frequency high-strength shock wave, to impact nanoparticles with an initial velocity, to enable the nanoparticles to be continuously accelerated downward in an axial direction of a large de Laval nozzle, until the nanoparticles are embedded on a grinding wheel surface at a maximum speed to form a nanolayer. The other wave source is used to clean impurities on the grinding wheel surface. In a processing process, the nanoparticles of the nanolayer are autonomously released in a core grinding region, to implement self-lubrication and cooling inside the grinding region. This method significantly enhances lubrication and cooling effects and satisfies the green development idea.

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