公开(公告)号：US20210252700A1

公开(公告)日：2021-08-19

申请号：US17150287

申请日：2021-01-15

Applicant: Harbin Institute of Technology

Inventor： Huijun GAO ,  Weiyang LIN ,  Chenlu LIU ,  Hao GUO ,  Xinghu YU ,  Mingsi TONG

IPC: B25J9/16 ,  G06K9/62

Abstract: The present disclosure relates to a visual servoing method based on fusion of distance space and image feature space. The method includes: constructing an image Jacobian matrix; constructing a depth Jacobian matrix; fusing the image Jacobian matrix and the depth Jacobian matrix, to obtain a hybrid visual servoing Jacobian matrix; and obtaining a robot motion control amount according to the hybrid visual servoing Jacobian matrix by using a control algorithm, to enable a robot to move to a target position, to complete precise positioning.

公开(公告)号：US20170193649A1

公开(公告)日：2017-07-06

申请号：US15323100

申请日：2016-01-16

Applicant: Harbin Institute of Technology

Inventor： Huijun GAO ,  Wanxin JIN ,  Xianqiang YANG ,  Jinyong YU ,  Guanghui SUN ,  Weiyang LIN ,  Zhan LI

IPC: G06T7/00 ,  G06T7/90

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T7/11 ,  G06T7/155 ,  G06T7/187 ,  G06T7/194 ,  G06T7/62 ,  G06T7/64 ,  G06T7/90 ,  G06T2207/20081 ,  G06T2207/30141 ,  G06T2207/30148

Abstract: A multi-type BGA chip visual recognition method using line based clustering to solve the problems of BGA inspection algorithms which have limited applicability, low flexibility caused by template matching, poor robustness to illumination and interferences and high time complexity. The method is based on: dynamic threshold segmentation of original image, morphological and connected component labelling; BGA extraction based on grayscale connected component and building information list for all complete grayscale BGA solder balls; Building of BGA solder ball label image; local analysis to determine the coarse orientation angle of equivalent BGA array; determining equivalent BGA solder ball clusters for each row and each column and the equivalent BGA solder ball cluster for the boundary by line based clustering; obtaining an accurate orientation angle and center position of BGA chip in the original image by line fitting of boundary BGA solder ball clusters; and extracting different standard parameters of BGA chips.