公开(公告)号：US20180205857A1

公开(公告)日：2018-07-19

申请号：US15742567

申请日：2016-06-29

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Sai Mun Chan ,  Hartmut Rudmann ,  Tae Yong Ahn ,  Kyu Won Hwang

IPC: H04N5/225 ,  H01L27/146 ,  H01L21/56 ,  H01L23/00 ,  G02B13/00 ,  G02B7/02 ,  G02B7/04 ,  H04N5/232

CPC classification number: H04N5/2257 ,  G02B7/021 ,  G02B7/028 ,  G02B7/04 ,  G02B13/0085 ,  H01L21/561 ,  H01L21/566 ,  H01L24/48 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23212 ,  H01L2224/45099

Abstract: Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer-level fabrication methods for making the modules.