公开(公告)号：US11414542B2

公开(公告)日：2022-08-16

申请号：US16646941

申请日：2018-09-19

Applicant: Hexion Inc.

Inventor： Gunda Kuhlmann ,  Christoph Scheuer ,  Panagiotis Saltapidas

IPC: C08J5/24 ,  C08G59/22 ,  C08G59/24 ,  C08G59/32 ,  C08G59/40 ,  C08G59/68 ,  C08G59/72 ,  C08L63/00 ,  C08G59/06 ,  C08G59/12 ,  H01B3/40 ,  C08G59/62 ,  B32B27/26 ,  B32B27/38 ,  C08K5/1545

Abstract: The invention relates to an impregnation resin mixture and to the use thereof. In one embodiment, an impregnation resin mixture includes a) at least one epoxide resin component selected from the group consisting of polyepoxides based on bisphenol A and/or F, and advancement resin produced therefrom, based on epoxidized halogenated bisphenols and/or epoxidized novolaks and/or polyepoxide esters based on phthalic acid, hexahydrophthalic acid, or based on terephthalic acid, epoxidized polyaddition products from dicyclopentadiene and phenol or cycloaliphatic compounds, b) as reactive diluents, 2 to 30 wt. % lactones with respect to the sum of the epoxy resin components, c) BCI3 and/or BCI3 complexes and/or a compound selected from the group of imidazoles and d) optionally additional additives, wherein the impregnation resin mixture does not contain any carboxylic acid anhydrides.

公开(公告)号：US20220259470A1

公开(公告)日：2022-08-18

申请号：US17720066

申请日：2022-04-13

Applicant: Hexion Inc.

Inventor： Thomas DRESSEN ,  Christoph Scheuer ,  Gunda Kuhlmann ,  Panagiotis Saltapidas

IPC: C09J161/14 ,  C09J11/08 ,  H01B3/36 ,  H02K3/30 ,  H02K3/40 ,  C09J161/06 ,  C08K5/17 ,  C08K3/16 ,  C08K5/3445 ,  C08L61/06

Abstract: Compositions for fixing a non-conductive material to a reinforcing layer are provided. In one embodiment, the composition being used to fix a non-conductive material on a reinforcing layer including a novolac produced by condensation of a substituted or unsubstituted phenol with an aldehyde in the presence of a catalyst, and optionally other additives.