公开(公告)号：US20230348655A1

公开(公告)日：2023-11-02

申请号：US17731580

申请日：2022-04-28

Applicant: Hexion Inc.

Inventor： Matthew SUMPTER

IPC: C08G59/24 ,  C08G59/50 ,  C08F220/28 ,  C09D163/00

CPC classification number: C08G59/24 ,  C08G59/5026 ,  C08F220/283 ,  C09D163/00 ,  C08G2150/00

Abstract: Embodiments of the present disclosure generally relate to epoxy resin compositions and coating systems used to form epoxy resin compositions. In an embodiment, an epoxy resin composition is provided. The resin composition includes an epoxy resin; a curing agent; and an acetoacetoxy-functionalized polymer.

公开(公告)号：US20190161613A1

公开(公告)日：2019-05-30

申请号：US15825931

申请日：2017-11-29

Applicant: Hexion Inc.

Inventor： Matthew SUMPTER ,  Yukun LI

IPC: C08L83/04 ,  C08L63/00 ,  C09D163/00 ,  C09D183/04

Abstract: A composition comprising a) an epoxy resin; b) a silicone resin; and c) an organosilane coupling agent having at least one protecting functional group, is disclosed. The composition can be used for coating applications.