公开(公告)号：US20100253361A1

公开(公告)日：2010-10-07

申请号：US12680447

申请日：2008-09-26

Applicant: Hidehiro Nakamura ,  Tooru Nakamura ,  Yutaka Hayashi ,  Yuji Kawanishi

Inventor： Hidehiro Nakamura ,  Tooru Nakamura ,  Yutaka Hayashi ,  Yuji Kawanishi

IPC: G01N27/62

CPC classification number: G01N27/423 ,  G01N27/42

Abstract: This invention provides a sensor having such a structure that the area in which a sensor electrode comes into contact with a liquid, a mist or a gas containing an analyte has been previously specified. The sensor comprises at least an electroconductive first electrode, an electroconductive second electrode, electroconductive first and second wirings connected to the first and second electrodes, and an insulating part for insulating the first and second wirings from each other and from a liquid, a mist or a gas containing the analyte. The insulating part is formed of an organic material. In the first and second electrodes, at least the surface, which comes into contact with a liquid, a mist or a gas containing the analyte, is formed of a material which is insoluble in a liquid or a mist containing the analyte, or is not attacked by a gas containing the analyte.

Abstract translation: 本发明提供了一种传感器，其具有以下结构：传感器电极与液体，雾或包含分析物的气体接触的区域已被预先规定。 传感器包括至少导电的第一电极，导电的第二电极，连接到第一和第二电极的导电的第一和第二布线，以及绝缘部分，用于将第一和第二布线彼此隔离，并与液体，雾或 含有分析物的气体。 绝缘部分由有机材料形成。 在第一和第二电极中，至少与液体接触的表面，雾或含有分析物的气体由不溶于液体或含有分析物的雾的材料形成，或不是 被含有分析物的气体攻击。

公开(公告)号：US07704799B2

公开(公告)日：2010-04-27

申请号：US11683714

申请日：2007-03-08

Applicant: Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

Inventor： Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

IPC: H01L21/50

CPC classification number: H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

Abstract translation: 布线基板（1）包括具有连接孔（11）的绝缘基座（10），设置在连接孔（11）中的埋入导体（12），而不到达绝缘基座（10）的后表面，并且布线层14 连接到埋地导体（12）。 掩埋导体（12）使布线层（14）变厚，并且可以在用于三维安装结构的连接孔（11）的后表面上形成对准部分（110）。 每个布线层（14）包括薄端子（14A），布线（14B）和厚电极（14C）。 不仅端子（14A）和配线（14B）以及埋地导体（12）都通过相同的制造工艺升高。 半导体元件（2）附着到布线基板（1）的电极（14C）上。

公开(公告)号：US5735042A

公开(公告)日：1998-04-07

申请号：US740282

申请日：1996-10-25

Applicant: Yasunari Takano ,  Hidehiro Nakamura ,  Shin Yoshida ,  Akito Miura ,  Koichi Takahashi ,  Kazuki Satou

Inventor： Yasunari Takano ,  Hidehiro Nakamura ,  Shin Yoshida ,  Akito Miura ,  Koichi Takahashi ,  Kazuki Satou

IPC: H01R13/04 ,  H01R12/71 ,  H01R13/40 ,  H01R13/428 ,  H01R43/16 ,  H01R43/20

CPC classification number: H01R43/16 ,  H01R12/57 ,  H01R12/721 ,  H01R13/40 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A pin contact of a connector and a method of fabricating the pin contact which enables a substantial decrease of manufacturing cost, and smooth installation of the pin connector without a change in the pitch of arrangement at the time of press-fitting into a pin housing. A flat metal sheet undergoes blanking and pressing to form a narrow piece including a strip portion of decreased area of a fracture. Then an approximately L-shaped connecting portion is bent at right angles to raise the narrow piece sideways. Thereafter the strip portion of the narrow piece is pressed along the direction of rising, to thereby form an approximately cylindrical contact section. A raised piece at the rear of the contact section is provided with a locking section which faces approximately at right angles with the direction of arrangement.

Abstract translation: 连接器的销触点和制造销触头的方法，其能够显着降低制造成本，并且平滑地安装销连接器，而不会在压配合到销壳体中时布置的间距变化。 平板金属板经受冲压和压制以形成包括断裂面积减小的带状部分的窄件。 然后将大致L形的连接部弯曲成直角，使窄片横向升高。 此后，窄片的条带部分沿着上升方向被按压，从而形成大致圆筒形的接触部分。 在接触部分的后部处的凸起部件设置有与安排方向大致成直角的锁定部。

公开(公告)号：US20140213116A1

公开(公告)日：2014-07-31

申请号：US14162143

申请日：2014-01-23

Applicant: Kazuta Yoshida ,  Yoshifumi Okabe ,  Hidehiro Nakamura

Inventor： Kazuta Yoshida ,  Yoshifumi Okabe ,  Hidehiro Nakamura

IPC: H01R12/72

CPC classification number: H01R12/714 ,  G06K7/0021 ,  H01R25/006

Abstract: A memory card connector includes first and second connectors including first and second housings having first and second storage sections, respectively, and first and second contacts which connect with terminals of first and second memory cards removably-inserted into the first and second storage sections, respectively. The first and second connectors are superposed on each other in a direction of thickness thereof. Each first contact includes a first tail which is mountable to a circuit board and positioned on an outer peripheral side of a first side surface of the first housing. The second housing includes a second side surface located at a different position from the first side surface as viewed in the thickness direction. Each second contact includes a second tail which is mountable to the circuit board and positioned on an outer peripheral side of the second side surface.

Abstract translation: 存储卡连接器包括分别具有第一和第二存储部分的第一和第二壳体的第一和第二连接器，以及分别与可拆卸地插入到第一和第二存储部分中的第一和第二存储卡的端子连接的第一和第二触点 。 第一和第二连接器在其厚度方向上彼此叠置。 每个第一触点包括可安装到电路板并位于第一壳体的第一侧表面的外周侧上的第一尾部。 第二壳体包括位于距厚度方向观察时与第一侧面不同位置的第二侧面。 每个第二触点包括可安装到电路板并位于第二侧表面的外周侧上的第二尾部。

公开(公告)号：US08648605B2

公开(公告)日：2014-02-11

申请号：US12680447

申请日：2008-09-26

Applicant: Hidehiro Nakamura ,  Tooru Nakamura ,  Yutaka Hayashi ,  Yuji Kawanishi

Inventor： Hidehiro Nakamura ,  Tooru Nakamura ,  Yutaka Hayashi ,  Yuji Kawanishi

IPC: G01N27/62

CPC classification number: G01N27/423 ,  G01N27/42

Abstract: This invention provides a sensor having such a structure that the area in which a sensor electrode comes into contact with a liquid, a mist or a gas containing an analyte has been previously specified. The sensor comprises at least an electroconductive first electrode, an electroconductive second electrode, electroconductive first and second wirings connected to the first and second electrodes, and an insulating part for insulating the first and second wirings from each other and from a liquid, a mist or a gas containing the analyte. The insulating part is formed of an organic material. In the first and second electrodes, at least the surface, which comes into contact with a liquid, a mist or a gas containing the analyte, is formed of a material which is insoluble in a liquid or a mist containing the analyte, or is not attacked by a gas containing the analyte.

Abstract translation: 本发明提供了一种传感器，其具有以下结构：传感器电极与液体，雾或包含分析物的气体接触的区域已被预先规定。 传感器包括至少导电的第一电极，导电的第二电极，连接到第一和第二电极的导电的第一和第二布线，以及绝缘部分，用于将第一和第二布线彼此隔离，并与液体，雾或 含有分析物的气体。 绝缘部分由有机材料形成。 在第一和第二电极中，至少与液体接触的表面，雾或含有分析物的气体由不溶于液体或含有分析物的雾的材料形成，或不是 被含有分析物的气体攻击。

公开(公告)号：US08028402B2

公开(公告)日：2011-10-04

申请号：US11775294

申请日：2007-07-10

Applicant: Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

Inventor： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC: H05K3/36 ,  H01R9/00 ,  H01K3/10

CPC classification number: H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.

Abstract translation: 公开了一种多层布线板的制造方法，该方法包括：准备连接板，连接板分别具有绝缘树脂组合物层，形成为穿过绝缘树脂组合物层的连接导体和导体电路 形成在绝缘树脂组合物层上并连接到连接导体; 对准连接板; 并且通过加热和压制层叠对准的连接板，使得连接导体或连接导体和导体电路彼此导电连接，并且连接板通过绝缘树脂组合物层彼此机械连接。 连接板通过特定的加工形成，包括使用三层复合金属层。

公开(公告)号：US07205645B2

公开(公告)日：2007-04-17

申请号：US10203652

申请日：2001-02-21

Applicant: Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

Inventor： Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

Abstract translation: 布线基板（1）包括具有连接孔（11）的绝缘基座（10），设置在连接孔（11）中的埋入导体（12），而不到达绝缘基座（10）的后表面，并且布线层14 连接到埋地导体（12）。 掩埋导体（12）使布线层（14）变厚，并且可以在用于三维安装结构的连接孔（11）的后表面上形成对准部分（110）。 每个布线层（14）包括薄端子（14A），布线（14B）和厚电极（14C）。 不仅端子（14A）和布线（14B）以及埋地导体（12）都通过相同的制造工艺升高。 半导体元件（2）附着到布线基板（1）的电极（14C）上。

公开(公告)号：US6015309A

公开(公告)日：2000-01-18

申请号：US38614

申请日：1998-03-11

Applicant: Hidehiro Nakamura ,  Kazuki Satou ,  Wataru Oguchi

Inventor： Hidehiro Nakamura ,  Kazuki Satou ,  Wataru Oguchi

IPC: H01R13/629 ,  H01R13/633 ,  H01R13/62

CPC classification number: H01R13/633 ,  H01R23/70

Abstract: In a PC card connector, first and second support shafts are mounted upright on a pin housing, and each provided with a pair of fall-preventive sections at the leading end thereof. A first turn arm is provided with a circular hole, a protrusion, a tongue, a concave section on the rim of the circular hole, and a pair of cutouts that cross the concave section, and the circular hole is fitted on the first support shaft through the cutouts so that the first turn arm can move pivotally. A second turn arm is formed similarly to the first turn arm, and a circular hole thereof is fitted on the second support shaft so that the second turn arm can move pivotally. A drive lever is provided with a circular hole, an engaging section, a coupling hole, a thin concave section formed on the rim of the circular hole, and a pair of cutouts that cross the concave section. The circular hole is fitted on the first support shaft through the cutouts so that the drive lever can move pivotally, and the drive lever and the first turn arm are prevented from falling off by the fall-preventive sections of the first support shaft. The tongues of the turn arms are engaged with the coupling hole of the drive lever, and the engaging section is engaged with a push-rod.

Abstract translation: 在PC卡连接器中，第一和第二支撑轴直立地安装在销壳体上，并且每个在其前端设置有一对防坠落部分。 第一转臂在圆形孔的边缘设置有圆形孔，突出部，舌部，凹部，以及与凹部交叉的一对切口，圆形孔安装在第一支撑轴上 通过切口使得第一转臂可以枢转地移动。 第二转臂与第一转动臂类似地形成，并且其圆形孔装配在第二支撑轴上，使得第二转臂能够枢转地移动。 驱动杆设置有圆形孔，接合部，联接孔，形成在圆形孔的边缘上的薄凹部和与凹部交叉的一对切口。 通过切口将圆形孔安装在第一支撑轴上，使得驱动杆可以枢转地移动，并且防止驱动杆和第一转动臂被第一支撑轴的防止部分脱落。 转臂的舌片与驱动杆的联接孔接合，并且接合部与推杆接合。

公开(公告)号：US5880405A

公开(公告)日：1999-03-09

申请号：US762116

申请日：1996-12-10

Applicant: Hidehiro Nakamura ,  Yasunari Takano ,  Tetsuya Furusawa

Inventor： Hidehiro Nakamura ,  Yasunari Takano ,  Tetsuya Furusawa

IPC: H01R4/02 ,  H05K1/18 ,  H05K3/34 ,  H05K13/04 ,  H02G3/08

CPC classification number: H05K13/046 ,  H05K3/3426 ,  H05K3/3421 ,  Y02P70/613

Abstract: A terminal structure for a surface mount electronic part including a terminal holding member formed from a synthetic resin, and external terminal extending from the terminal holding member for soldering to soldering lands of a printed wiring board. Each of the external terminals is held on the terminal holding member such that a straight portion projects laterally from the terminal holding member and is restricted direction (i.e., in width and thickness directions). The outermost tip portion of each external terminal includes an offset portion which is stepped downwards relative to the straight portion of the external terminal includes an offset portion which is stepped downwards relative to the straight portion of the external terminal and which is formed by half punching. The offset portion is provided for soldering to a soldering land of the printed wiring board. A region of the lower surface of the offset portion of each external terminal, which is continuous with a front end surface of the offset portion, is beveled to form an inclined surface such that the thickness of the offset portion decreases toward the front end surface.

Abstract translation: 一种用于表面安装电子部件的端子结构，其包括由合成树脂形成的端子保持部件，以及从端子保持部件延伸到焊接到印刷线路板的焊接区域的外部端子。 每个外部端子被保持在端子保持构件上，使得直线部分从端子保持构件横向突出并且是限制方向（即，宽度和厚度方向）。 每个外部端子的最外端部包括相对于外部端子的直线部分向下台阶的偏移部分，其包括相对于外部端子的直线部分向下台阶并且通过半冲压形成的偏移部分。 偏移部分被设置用于焊接到印刷线路板的焊接区域。 每个外部端子的偏移部分的下表面的与偏移部分的前端表面连续的区域被倒角以形成倾斜表面，使得偏移部分的厚度朝向前端表面减小。

公开(公告)号：US5738532A

公开(公告)日：1998-04-14

申请号：US602201

申请日：1996-02-16

Applicant: Yasunari Takano ,  Hidehiro Nakamura ,  Shin Yoshida ,  Akito Miura ,  Koichi Takahashi ,  Kazuki Satou

Inventor： Yasunari Takano ,  Hidehiro Nakamura ,  Shin Yoshida ,  Akito Miura ,  Koichi Takahashi ,  Kazuki Satou

IPC: H01R13/04 ,  H01R12/71 ,  H01R13/40 ,  H01R13/428 ,  H01R43/16 ,  H01R43/20 ,  H01R9/09

CPC classification number: H01R43/16 ,  H01R12/57 ,  H01R12/721 ,  H01R13/40 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A pin contact of a connector and a method of fabricating the pin contact which enables a substantial decrease of manufacturing cost, and smooth installation of the pin connector without a change in the pitch of arrangement at the time of press-fitting into a pin housing. A flat metal sheet undergoes blanking and pressing to form a narrow piece including a strip portion of decreased area of a fracture. Then an approximately L-shaped connecting portion is bent at right angles to raise the narrow piece sideways. Thereafter the strip portion of the narrow piece is pressed along the direction of rising, to thereby form an approximately cylindrical contact section. A raised piece at the rear of the contact section is provided with a locking section which faces approximately at right angles with the direction of arrangement.

Abstract translation: 连接器的销触点和制造销触头的方法，其能够显着降低制造成本，并且平滑地安装销连接器，而不会在压配合到销壳体中时布置的间距变化。 平板金属板经受冲压和压制以形成包括断裂面积减小的带状部分的窄片。 然后将大致L形的连接部弯曲成直角，使窄片横向升高。 此后，窄片的条带部分沿着上升方向被按压，从而形成大致圆筒形的接触部分。 在接触部分的后部处的凸起部件设置有与安排方向大致成直角的锁定部。