公开(公告)号：US09144157B2

公开(公告)日：2015-09-22

申请号：US13813678

申请日：2011-07-28

Applicant: Hiroto Iida

Inventor： Hiroto Iida

IPC: H05K1/09 ,  H05K3/06 ,  H05K3/46 ,  H05K1/02 ,  H05K3/42 ,  H05K3/38

CPC classification number: H05K3/06 ,  H05K1/0298 ,  H05K3/386 ,  H05K3/421 ,  H05K3/425 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09563

Abstract: Object of the present invention is to provide a method for manufacturing a printed wiring board which enables fine wiring formation at low costs and with high yields without introducing any special equipment, and a printed wiring board manufactured by the method. To achieve the object, a method for forming the wiring pattern adopted includes steps; for forming a laminate having a structure in which a copper foil layer formed using copper foil without roughening treatment having surface roughness (Rzjis) at a bonding surface of 2 μm or less and thickness of 5 μm or less is laminated to a conductive layer via an insulating layer; for providing a blind-hole composed of a hole perforating the copper foil layer and the insulating layer; and a bottom composed of the conductive layer in the laminate; for filling-up the blind-hole by a electro-plated copper in the time for depositing an electro-plated copper layer on a surface of the electroless-plated copper layer to make the total thickness of a copper layer provided on the insulating layer 15 μm or less, for providing of an etching resist layer having thickness of 15 μm or less and for etching of the copper layer.

Abstract translation: 本发明的目的在于提供一种制造印刷电路板的方法，该印刷电路板能够以低成本和高产率进行精细的布线形成而不引入任何专用设备，以及通过该方法制造的印刷线路板。 为了实现该目的，用于形成布线图案的方法包括步骤： 为了形成具有这样的结构的层压体，其中使用铜箔形成的铜箔层，在不具有表面粗糙度（Rzjis）的2μm以下且厚度为5μm以下的表面粗糙度（Rzjis）的情况下，通过经由 绝缘层; 用于提供由穿孔铜箔层和绝缘层的孔构成的盲孔; 以及由层叠体中的导电层构成的底部; 在电镀铜层的表面上沉积电镀铜层的时间，通过电镀铜填充盲孔，使得设置在绝缘层15上的铜层的总厚度 μm以下，用于提供厚度为15μm以下的蚀刻抗蚀剂层和蚀刻铜层。