Phase Change Module and Electronic Device Mounted with Same
    1.
    发明申请
    Phase Change Module and Electronic Device Mounted with Same 审中-公开
    相变模块和相同的电子设备

    公开(公告)号:US20150103486A1

    公开(公告)日:2015-04-16

    申请号:US14509522

    申请日:2014-10-08

    Applicant: Hitachi, Ltd.

    Abstract: To provide a phase change module as a cooling system capable of saving energy and miniaturizing of the cooling system utilizing a thermo siphon, and an electronic device suitable to mounting such a phase change module.The phase change module 300 includes a jacket case 312 attached with an evaporator surface 311 with the evaporator surface 311 being arranged on a heat generating body, a radiator case 321 attached with cooling fins (radiator) 322 arranged at a position departing from the heat generating body, and a connecting plate 330 that connects the jacket case 312 and the radiator case 321, in which holes are bored in the connecting plate 330 at a position where the jacket case 312 and the radiator case 321 overlap.

    Abstract translation: 提供一种相变模块作为能够利用热虹吸管节约能源和冷却系统的小型化的冷却系统,以及适于安装这种相变模块的电子设备。 相变模块300包括附接有蒸发器表面311的护套壳体312,蒸发器表面311布置在发热体上,散热器壳体321附接有布置在离开发热体的位置的冷却翅片(散热器)322 主体和连接壳体312和散热器壳体321的连接板330,其中,在壳体312和散热器壳体321重叠的位置处,在连接板330中钻有孔。

    COOLING SYSTEM AND ELECTRONIC APPARATUS USING THE SAME
    2.
    发明申请
    COOLING SYSTEM AND ELECTRONIC APPARATUS USING THE SAME 审中-公开
    冷却系统和使用它的电子设备

    公开(公告)号:US20140090814A1

    公开(公告)日:2014-04-03

    申请号:US13971339

    申请日:2013-08-20

    Applicant: Hitachi, Ltd.

    Abstract: The invention relates to a cooling system and an electronic apparatus using the same, and particularly aims to use a thermosiphon as the cooling system and derives an optimum shape (inter-fin gap, fin height, and fin upper-end hole diameter) of a boiling heat transfer surface for different coolants. In a cooling system using a thermosiphon according to the invention, an optimum shape (inter-fin gap, fin height, and fin upper-end hole diameter) of a boiling heat transfer surface of a heat receiving jacket that forms the cooling system is identified based on a critical radius of a steam bubble produced in an overheated liquid and the diameter of an air bubble departing from the heat transfer surface for a variety of coolants.

    Abstract translation: 本发明涉及一种冷却系统和使用该冷却系统的电子设备,特别是旨在使用热虹吸管作为冷却系统,并获得最佳形状(翅片间间隙,翅片高度和翅片上端孔直径) 沸腾的传热表面用于不同的冷却剂。 在使用根据本发明的热虹吸管的冷却系统中,识别形成冷却系统的热接收套管的沸腾传热表面的最佳形状(间翅片间隙,翅片高度和翅片上端孔直径) 基于在过热液体中产生的蒸汽气泡的临界半径以及从各种冷却剂的传热表面离开的气泡的直径。

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