公开(公告)号：US11786223B2

公开(公告)日：2023-10-17

申请号：US17189292

申请日：2021-03-02

Applicant: Hitachi, Ltd.

Inventor： Wataru Sawada ,  Toru Watanabe

IPC: A61B8/00 ,  B06B1/06 ,  H10N30/80 ,  H10N30/87

CPC classification number: A61B8/546 ,  A61B8/4488 ,  B06B1/067 ,  B06B1/0622 ,  H10N30/80 ,  H10N30/875 ,  B06B2201/76

Abstract: An ultrasonic probe has a transduction layer in which a plurality of transducers are placed, a backing layer provided at a rear side of the transduction layer with a wiring layer therebetween, and a plurality of heat dissipation members provided in the backing layer. The plurality of heat dissipation members extend in a line form in the backing layer, and are placed with an aligned direction of extension. An area occupancy percentage of the heat dissipation member at a center region of the backing layer is larger than that at an outer side of the center region. The center region is not positioned at ends of the cross section intersecting the direction of extension of the heat dissipation member, includes a center of gravity of the cross section, and occupies an area less than or equal to a half of an area of the cross section.

公开(公告)号：US10672972B2

公开(公告)日：2020-06-02

申请号：US15551304

申请日：2016-01-18

Applicant: Hitachi, Ltd.

Inventor： Kazuya Motoki ,  Kazuhiro Kobayashi ,  Toru Watanabe

IPC: H01L41/113 ,  G01S7/521 ,  H01L41/09 ,  H04R17/00 ,  A61B8/14 ,  H04R17/10

Abstract: A resonance layer (30) and an acoustic separation layer (34) are arranged adjacent to each other between a piezoelectric element (24) and a circuit board (16) provided with an electronic circuit for driving the piezoelectric element. The acoustic impedance of the resonance layer (30) is higher than that of the piezoelectric element (24), and the acoustic impedance of the acoustic separation layer (34) is lower than that of the circuit board (16). An ultrasonic wave is reflected at the interface between the resonance layer (30) and the acoustic separation layer (34) where the difference in acoustic impedance is large, and the ultrasonic wave propagating to the circuit-board (16) side is reduced.

公开(公告)号：US20200289090A1

公开(公告)日：2020-09-17

申请号：US16651417

申请日：2018-12-26

Applicant: Hitachi, Ltd.

Inventor： Takayuki Iwashita ,  Takashi Fujii ,  Kazuho Yoshimura ,  Toru Watanabe

IPC: A61B8/00 ,  A61B8/08 ,  B29C65/48

Abstract: A second stacked product is configured with a flexible wiring sheet, and a stacked-element array supported by the flexible wiring sheet. To a biological-body side of the stacked-element array, a ground film is bonded, whereby a structurally reinforced third stacked product is produced. Then, the third stacked product is bent, whereby a curved stacked product is produced. In the bending procedure, in the ground film, a plurality of extension parts arranged along the θ direction are automatically formed.

公开(公告)号：US11523804B2

公开(公告)日：2022-12-13

申请号：US16628252

申请日：2018-06-08

Applicant: Hitachi, Ltd.

Inventor： Kazuya Motoki ,  Toru Watanabe ,  Gen Shiina ,  Kazuhiro Kobayashi

IPC: A61B8/00 ,  A61B8/15 ,  G01K11/26

Abstract: In order to estimate a temperature of a transmission-reception wavefront of a probe head, a first computing unit and a second computing unit are provided. The first computing unit estimates a temperature TA of the transmission-reception wavefront according to a basic function based on an internal temperature T1, an ambient temperature T2, power consumption Ptotal (=Pic+Ptd), and any other parameter. The basic function is a linear function. The second computing unit estimates a temperature TB of the transmission-reception wavefront according to an auxiliary function based on a previously estimated temperature Tpre, an internal temperature difference ΔT1, and any other, parameter. A selection unit selects any of the temperatures TA and TB depending on situations.