公开(公告)号：US11927466B2

公开(公告)日：2024-03-12

申请号：US17291535

申请日：2019-11-14

Applicant: Hitachi Astemo, Ltd.

Inventor： Takayuki Yogo ,  Binti Haridan Fatin Farhanah ,  Hiroyuki Abe ,  Satoshi Ikeo ,  Yuta Chiba

IPC: G01F1/69 ,  F02D41/30

CPC classification number: G01F1/69 ,  F02D41/30

Abstract: A physical quantity measurement device is configured to seal a cavity portion on a back surface side of a diaphragm of a thermal air flow rate sensor while improving measurement accuracy. The device may include a lead frame having a mounting surface on which a flow rate sensor which is the thermal air flow rate sensor is mounted, and a flow passage forming member disposed on a back surface opposite to the mounting surface of the lead frame. A ventilation flow path is formed by a first through hole in communication with a cavity portion of the flow rate sensor, a second through hole provided in the lead frame and opened in the mounting surface, and a connection flow path that is defined between the lead frame and the flow passage forming member and connecting the first through hole and the second through hole.

公开(公告)号：US12203793B2

公开(公告)日：2025-01-21

申请号：US17776859

申请日：2020-10-20

Applicant: Hitachi Astemo, Ltd.

Inventor： Takayuki Yogo ,  Binti Haridan Fatin Farhanah ,  Akira Uenodan ,  Hiroyuki Abe ,  Mizuki Ijuin

IPC: G01F15/16

Abstract: The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.

公开(公告)号：US12169137B2

公开(公告)日：2024-12-17

申请号：US17801620

申请日：2020-12-25

Applicant: Hitachi Astemo, Ltd.

Inventor： Binti Haridan Fatin Farhanah ,  Hiroyuki Abe ,  Takayuki Yogo ,  Nozomi Yatsumonji ,  Mizuki Ijuin

IPC: G01F1/692

Abstract: To provide an airflow amount measuring device capable of accurately measuring a flow amount of air without occurrence of warpage in a thin film portion when an airflow measuring element is mounted on a lead frame to form a resin-sealed package in which the airflow amount measuring element and the lead frame are sealed. A chip package includes a lead frame, an element mounted on the lead frame and having a detection portion, and a structure for sealing the lead frame and the element such that at least the detection portion is exposed. Then, the curvature radius ρ of the exposed portion of the element exposed from the sealing resin member is 2.13 or less.

公开(公告)号：US12119287B2

公开(公告)日：2024-10-15

申请号：US17288618

申请日：2019-09-20

Applicant: Hitachi Astemo, Ltd.

Inventor： Binti Haridan Fatin Farhanah ,  Takayuki Yogo ,  Hiroyuki Abe

IPC: H01L23/49 ,  G01F5/00 ,  H01L23/04 ,  H01L23/31 ,  H01L23/495 ,  H01L29/84 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L23/495 ,  G01F5/00 ,  H01L23/04 ,  H01L23/31 ,  H01L23/49551 ,  H01L29/84 ,  H05K1/18 ,  H05K3/3421 ,  H05K3/3494 ,  H01L2224/83815 ,  H05K2203/043

Abstract: To obtain a chip package positioning structure capable of adjusting a tilt and a position of a chip package with respect to the circuit board and reducing mounting variations. The chip package positioning and fixing structure that positions and fixes, to a circuit board 4, a chip package 5 in which a flow rate detection element 53 is sealed with a resin so that a detection portion is at least exposed, in which the chip package includes a solder fixation portion 52 that fixes the chip package to the circuit board by soldering, and a positioning portion 514 that performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element from the solder fixation portion.

公开(公告)号：US11965761B2

公开(公告)日：2024-04-23

申请号：US17796957

申请日：2020-12-22

Applicant: Hitachi Astemo, Ltd.

Inventor： Mizuki Shibata ,  Takayuki Yogo ,  Akira Uenodan ,  Hiroyuki Abe ,  Binti Haridan Fatin Farhanah

IPC: G01F1/684 ,  G01F5/00

CPC classification number: G01F1/6842 ,  G01F1/6845 ,  G01F5/00

Abstract: Provided is a highly reliable thermal flow meter. In a thermal flow meter 20, a flow rate detection element 321 that detects an air flow rate, and a conductive coating film 400 containing a conductive substance and a resin as constituent elements are provided on at least a part of a portion provided in an auxiliary passage 135 on a surface facing a detection surface 322 of the flow rate detection element 321.