公开(公告)号：US20220007556A1

公开(公告)日：2022-01-06

申请号：US17294576

申请日：2019-01-15

Applicant: Hitachi High-Tech Corporation

Inventor： Ichiro MIYANO ,  Osamu KOMURO ,  Masakazu TAKAHASHI ,  Masashi FUJITA

IPC: H05K9/00 ,  H01J37/09

Abstract: Provided is an electromagnetic field shielding plate, etc., in which it is possible to reduce weight while achieving high shielding performance from relatively high-frequency electromagnetic fields. The electromagnetic field shielding plate is configured by layering a permalloy layer 3 comprising a plate or sheet of permalloy, and an amorphous layer 1 comprising an Fe—Si—B—Cu—Nb-based amorphous plate or sheet.