公开(公告)号：US12009494B2

公开(公告)日：2024-06-11

申请号：US17152384

申请日：2021-01-19

Applicant: Hong Kong Applied Science and Technology Research Institute Co., Ltd.

Inventor： Jing Xiang ,  Pau Yee Lim ,  Laiyong Xie

IPC: H01M10/653 ,  H01M10/613 ,  H01M10/655

CPC classification number: H01M10/653 ,  H01M10/613 ,  H01M10/655

Abstract: Systems and methods in which a thermal conductive composite comprises a non-uniform heat absorption profile of a thermal reactive material are described. Thermal conductive composites herein may be utilized in thermal regulatory modules with a gradient structure configured to transfer heat energy away from an area near a heat source to an area with a relatively large latent heat absorbing capacity. Thermal conductive material may be provided in a frame structure having lower porosity in a first region more near a heat source and higher porosity in a second region more distant from the heat source. A thermal reactive material may be deposited so as to be disposed within the pores of the thermal conductive material frame structure wherein the density of the thermal reactive material in the first region of the thermal conductive composite is lower than that at the second region of the thermal conductive composite.

公开(公告)号：US20220231352A1

公开(公告)日：2022-07-21

申请号：US17152384

申请日：2021-01-19

Applicant: Hong Kong Applied Science and Technology Research Institute Co., Ltd.

Inventor： Jing Xiang ,  Pau Yee Lim ,  Laiyong Xie

IPC: H01M10/653 ,  H01M10/613 ,  H01M10/655

Abstract: Systems and methods in which a thermal conductive composite comprises a non-uniform heat absorption profile of a thermal reactive material are described. Thermal conductive composites herein may be utilized in thermal regulatory modules with a gradient structure configured to transfer heat energy away from an area near a heat source to an area with a relatively large latent heat absorbing capacity. Thermal conductive material may be provided in a frame structure having lower porosity in a first region more near a heat source and higher porosity in a second region more distant from the heat source. A thermal reactive material may be deposited so as to be disposed within the pores of the thermal conductive material frame structure wherein the density of the thermal reactive material in the first region of the thermal conductive composite is lower than that at the second region of the thermal conductive composite.