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公开(公告)号:US11387226B2
公开(公告)日:2022-07-12
申请号:US17090510
申请日:2020-11-05
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Yadong Bai , Zhijun Qu , Changxing Sun , Haitao Han
Abstract: This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.
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公开(公告)号:US12114425B2
公开(公告)日:2024-10-08
申请号:US17942442
申请日:2022-09-12
Applicant: Huawei Technologies Co., Ltd.
Inventor: Guodong Zhang , Chong Chen , Jian Zhang , Shaoyong Xiang , Zhijun Qu , Changxing Sun
CPC classification number: H05K1/116 , H05K1/184 , H05K2201/09509 , H05K2201/10901
Abstract: A signal transmission structure includes a circuit board, a chip, and a cable assembly. The chip is assembled on one side of the circuit board, and the cable assembly is assembled on the other side of the circuit board. The cable assembly includes a cable, and the circuit board includes a plurality of conductive holes. The chip is electrically connected to the cable of the cable assembly using the conductive hole to transmit a signal of the chip using the cable.
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公开(公告)号:US20230007773A1
公开(公告)日:2023-01-05
申请号:US17942442
申请日:2022-09-12
Applicant: Huawei Technologies Co., Ltd.
Inventor: Guodong Zhang , Chong Chen , Jian Zhang , Shaoyong Xiang , Zhijun Qu , Changxing Sun
Abstract: A cable assembly, a signal transmission structure, and an electronic device are provided. The signal transmission structure includes a circuit board (2), a chip (1), and a cable assembly (3). The chip (1) is assembled on one side of the circuit board (2), and the cable assembly (3) is assembled on the other side of the circuit board (2). The cable assembly (3) includes a cable (31), and the circuit board (2) includes a plurality of conductive holes (22). The chip (1) is electrically connected to the cable (31) of the cable assembly (3) by using the conductive hole (22), to transmit a signal of the chip (1) by using the cable (31). In this technical solution, wires do not need to be disposed in a large area inside the circuit board (2).
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公开(公告)号:US20210143141A1
公开(公告)日:2021-05-13
申请号:US17090510
申请日:2020-11-05
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Yadong Bai , Zhijun Qu , Changxing Sun , Haitao Han
Abstract: This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.
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