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公开(公告)号：US09681549B2
公开(公告)日：2017-06-13
申请号：US15261389
申请日：2016-09-09
Applicant: Huawei Technologies Co., Ltd.
Inventor： Tewei Chen , Huili Fu , Nan Zhao
CPC classification number: H05K1/181 , H01F5/00 , H01F19/00 , H01F27/292 , H01F2005/006 , H05K3/3426 , H05K2201/1003 , H05K2201/10121 , H05K2201/10757 , Y02P70/613
Abstract: A conical inductor provided in the present invention includes: a housing, a conical coil located inside the housing, a first pin and a second pin respectively connected to two ends of the conical coil, where one end of the first pin is connected to one end of the conical coil, the other end of the first pin is connected to a hole in a first side wall of the housing in a fastened manner, one end of the second pin is connected to the other end of the conical inductor, and the other end of the second pin is connected to a hole in a second side wall of the housing in a fastened manner; and each of the first pin and the second pin includes one segment of waveform segment fluctuating in a direction perpendicular to a top wall of the housing.
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公开(公告)号：US09349708B2
公开(公告)日：2016-05-24
申请号：US14729316
申请日：2015-06-03
Applicant: Huawei Technologies Co., Ltd.
Inventor： Huili Fu , Xiaodong Zhang
IPC: H01L23/52 , H01L25/065 , H01L23/48 , H01L23/528 , H01L23/538 , H01L23/498
CPC classification number: H01L25/0652 , H01L23/481 , H01L23/49816 , H01L23/528 , H01L23/5384 , H01L23/5389 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/24137 , H01L2224/73204 , H01L2225/06548 , H01L2225/06555 , H01L2225/06572 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/10253 , H01L2924/1434 , H01L2924/15311 , H01L2924/014
Abstract: A chip stacked package structure includes a first chip and a second chip, where the second chip is stacked with the first chip and the second chip includes a package layer and a first routing layer, where the package layer includes at least two dies and an attaching part configured to attach the at least two dies, where the attaching part is provided with multiple vias, with a part of vias in the multiple vias disposed at an outer periphery of the at least two dies, and the other part of vias in the multiple vias disposed between the at least two dies, and the first routing layer electrically connects the at least two dies; where the package layer is located between the first routing layer and the first chip, an electrically conductive material is provided in the multiple vias.
Abstract translation: 芯片堆叠封装结构包括第一芯片和第二芯片，其中第二芯片与第一芯片堆叠，并且第二芯片包括封装层和第一布线层，其中封装层包括至少两个模具和附接 部件，其构造成附接所述至少两个模具，其中所述附接部件设置有多个通孔，所述多个通孔中的多个通孔中的一部分通孔设置在所述至少两个模具的外周边，并且所述多个通孔中的另一部分通孔 设置在所述至少两个管芯之间的通孔，并且所述第一布线层电连接所述至少两个管芯; 其中封装层位于第一布线层和第一芯片之间，在多个通孔中提供导电材料。
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公开(公告)号：US20160381803A1
公开(公告)日：2016-12-29
申请号：US15261389
申请日：2016-09-09
Applicant: Huawei Technologies Co., Ltd.
Inventor： Tewei Chen , Huili Fu , Nan Zhao
CPC classification number: H05K1/181 , H01F5/00 , H01F19/00 , H01F27/292 , H01F2005/006 , H05K3/3426 , H05K2201/1003 , H05K2201/10121 , H05K2201/10757 , Y02P70/613
Abstract: A conical inductor provided in the present invention includes: a housing, a conical coil located inside the housing, a first pin and a second pin respectively connected to two ends of the conical coil, where one end of the first pin is connected to one end of the conical coil, the other end of the first pin is connected to a hole in a first side wall of the housing in a fastened manner, one end of the second pin is connected to the other end of the conical inductor, and the other end of the second pin is connected to a hole in a second side wall of the housing in a fastened manner; and each of the first pin and the second pin includes one segment of waveform segment fluctuating in a direction perpendicular to a top wall of the housing.
Abstract translation: 本发明提供的圆锥形电感器包括：壳体，位于壳体内的锥形线圈，分别连接到锥形线圈的两端的第一销和第二销，其中第一销的一端连接到一端 所述第一销的另一端以紧固的方式连接到所述壳体的第一侧壁中的孔，所述第二销的一端连接到所述锥形电感器的另一端，并且所述另一端连接到所述锥形电感器的另一端 第二销的端部以紧固方式连接到壳体的第二侧壁中的孔; 并且所述第一销和所述第二销中的每一个包括在垂直于所述壳体的顶壁的方向上波动的一段波形段。
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