公开(公告)号：US20230269862A1

公开(公告)日：2023-08-24

申请号：US18308267

申请日：2023-04-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wenliang Li ,  Yongwei Chen ,  Xusheng Liu ,  Zhong Yan ,  Zewen Wang

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0225 ,  H05K1/116 ,  H05K2201/09609 ,  H05K2201/096

Abstract: A printed circuit board includes a plurality of layer structures disposed in a stacked manner, and the printed circuit board has a disposing face. A differential pair unit and a shielding structure for shielding the differential pair unit are disposed on the disposing face. The differential pair unit includes two signal via holes, each signal via hole passes through the plurality of layer structures, and an anti-pad corresponding to each signal via hole is disposed on a ground layer through which the signal via hole passes. A part of metal of a ground layer is spaced between two anti-pads. Each signal corresponds to one anti-pad, and a ground layer is spaced between anti-pads.

公开(公告)号：US20230049934A1

公开(公告)日：2023-02-16

申请号：US17969252

申请日：2022-10-19

Applicant: Huawei Technologies Co., Ltd.

Inventor： Kejian Wang ,  Yongwei Chen ,  Yinhai Pan ,  Yongyao Li ,  Maobin Fan

IPC: H04W52/02

Abstract: A data interface sleep and wakeup method includes receiving data information sent by a second electronic device, where the data information includes sleep information, and setting, based on the sleep information, at least one data interface to either a sleep state or a wakeup state.