公开(公告)号：US20080146048A1

公开(公告)日：2008-06-19

申请号：US11950825

申请日：2007-12-05

Applicant: Hubert Nestler

Inventor： Hubert Nestler

IPC: H01R12/14 ,  B23P11/00

CPC classification number: H05K3/363 ,  H05K1/0206 ,  H05K3/3494 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/0278 ,  Y10T29/49128

Abstract: A printed circuit board connection has a first printed circuit board that includes a nonconductive plate-shaped first substrate with at least one first conductor track on the upper side, a second printed circuit board including a nonconductive plate-shaped second substrate with at least one second conductor track on the underside, with the first conductor track and the second conductor track being electrically conductively connected by solder. On the upper side of the second substrate, a third conductor track is provided, which is diametrically opposite the second conductor track, and the second conductor track and the third conductor track are connected electrically conductively to one another via at least one opening in the second substrate, in order to make a heat-conducting connection of the heated soldering die with the solder.

Abstract translation: 印刷电路板连接具有第一印刷电路板，该第一印刷电路板包括在上侧具有至少一个第一导体轨道的非导电板状第一基板，第二印刷电路板，包括具有至少一个第二电极的非导电板状第二基板 下侧的导体轨道，第一导体轨道和第二导体轨道通过焊料导电连接。 在第二基板的上侧，设置与第二导体轨道径向相反的第三导体轨道，并且第二导体轨道和第三导体轨道通过第二导体轨道中的至少一个开口彼此电连接 基板，以便使加热的焊接模具与焊料的导热连接。