公开(公告)号：US20130101143A1

公开(公告)日：2013-04-25

申请号：US13278558

申请日：2011-10-21

Applicant: Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Ming-Li Hsu

Inventor： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Ming-Li Hsu

IPC: H04R1/00

CPC classification number: H04R31/006 ,  H04R1/2807 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/03

Abstract: A MEMS microphone chip with an expanded chamber comprises a base plate, and the base plate has a main chamber and a secondary chamber. The secondary chamber is formed beside the main chamber, and is connected to the main chamber. A vibration membrane is suspended above the main chamber for receiving external sound waves, and the vibration membrane vibrates in corresponding to the chambers. The MEMS microphone chip has a higher sensitivity because of the expanded chamber, and therefore has a more ideal audio frequency response curve.

Abstract translation: 具有扩展室的MEMS麦克风芯片包括基板，并且基板具有主室和次室。 副室形成在主室旁边，并连接到主室。 振动膜悬挂在主室上方，用于接收外部声波，振动膜相应于腔室振动。 由于扩大的腔室，MEMS麦克风芯片具有更高的灵敏度，因此具有更理想的音频响应曲线。

公开(公告)号：US20120308066A1

公开(公告)日：2012-12-06

申请号：US13153121

申请日：2011-06-03

Applicant: Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Kuo-Hsiang Li ,  Yung-Ta Chen

Inventor： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Kuo-Hsiang Li ,  Yung-Ta Chen

IPC: H04R1/00 ,  H04R31/00

CPC classification number: H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005

Abstract: A combined MicroElectroMechanical Systems (MEMS) microphone includes a first substrate, a second substrate, a vibrating diaphragm, a backplate, and an accommodating slot. The first substrate has a first chamber, the vibrating diaphragm is disposed on the first chamber, the second substrate has a second chamber, one side of the backplate is disposed on the second chamber, and the other side of the backplate is disposed on the vibrating diaphragm, so that the second substrate is combined with the first substrate. In addition, the backplate has multiple sound holes, and the accommodating slot is disposed between the first substrate and the second substrate to form a space between the vibrating diaphragm and the backplate.

Abstract translation: 组合的微电子机械系统（MEMS）麦克风包括第一基板，第二基板，振动膜，背板和容纳槽。 第一基板具有第一室，振动膜设置在第一室上，第二基板具有第二室，背板的一侧设置在第二室上，背板的另一侧设置在振动 使第二基板与第一基板结合。 此外，背板具有多个声孔，并且容纳槽设置在第一基板和第二基板之间，以在振动膜和背板之间形成空间。

公开(公告)号：US20120023718A1

公开(公告)日：2012-02-02

申请号：US13273761

申请日：2011-10-14

Applicant: Hung-Jen CHEN

Inventor： Hung-Jen CHEN

IPC: D04H1/46

CPC classification number: D04H5/03 ,  D04H1/4374 ,  D04H1/492 ,  D04H1/498 ,  Y10T428/24033

Abstract: A method for manufacturing a conductive fabric and products thereof mainly fastens a first soft base and a second soft base with a conductive yarn interposed between them with spaced dot-type fastening spots through a fastening means to facilitate fast production of the conductive fabric. The fastening means could be a needle punching apparatus to provide needle punching on an upper layer fabric and a lower layer fabric without hitting the conductive yarn interposed between them. Thus all three of them can be fastened with the spaced dot-type fastening spots. And the conductive fabric can be produced more efficiently.

Abstract translation: 一种导电性织物的制造方法及其制造方法，主要是通过紧固装置将具有间隔开的点状紧固点插入其间的导电性纱线的第一柔软基材和第二软质基材紧固，以促进导电性织物的快速制造。 紧固装置可以是针刺装置，用于在上层织物和下层织物上提供针刺，而不会在其间插入导电丝。 因此，它们中的所有三个可以用间隔开的点型紧固点紧固。 并且可以更有效地生产导电织物。

公开(公告)号：US20120308037A1

公开(公告)日：2012-12-06

申请号：US13153074

申请日：2011-06-03

Applicant: Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Ming-Li Hsu ,  Xian-Gen Liao

Inventor： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Ming-Li Hsu ,  Xian-Gen Liao

IPC: H04R3/00 ,  H04R31/00

CPC classification number: H04R19/005 ,  Y10T29/49005

Abstract: A microelectromechanical microphone chip having a stereoscopic diaphragm structure includes a base, having a chamber; a diaphragm, disposed on the chamber and having steps with height differences; and a back plate, disposed on the diaphragm, forming a space with the diaphragm in between, and having a plurality of sound-holes communicating with the space.

Abstract translation: 具有立体光阑结构的微电机麦克风芯片包括具有腔室的底座; 隔膜，设置在室上并具有高度差的台阶; 以及设置在所述隔膜上的后板，在所述隔膜之间形成有与所述隔膜连通的多个声孔的空间。

公开(公告)号：US20130322661A1

公开(公告)日：2013-12-05

申请号：US13482350

申请日：2012-05-29

Applicant: Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Min-Li Hsu

Inventor： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Min-Li Hsu

IPC: H04R19/04

CPC classification number: H04R19/04 ,  H04R19/005 ,  H04R31/00

Abstract: A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed. above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with. a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.

Abstract translation: 具有扩展后室的MEMS麦克风芯片包括第一芯片单元和第二芯片单元。 第一芯片单元具有第一基板，形成振动膜层。 在第一基板的端部之上，并且在第一基板的振动膜层的下方形成空间，使得振动膜层悬挂在第一基板上方振动。 第二芯片单元具有与第一基板的另一端连接的第二基板，并且在第二基板中形成有凹槽。 宽度大于空间的宽度; 当第一基板和第二基板联接在一起时，槽和空间连接在一起以用作振动膜层的后室。

公开(公告)号：US20130075835A1

公开(公告)日：2013-03-28

申请号：US13241956

申请日：2011-09-23

Applicant: Hung-Jen CHEN ,  Kuan-Hsun CHIU ,  Ju-Mei LU ,  Ming-Li HSU ,  Chun-Chieh WANG

Inventor： Hung-Jen CHEN ,  Kuan-Hsun CHIU ,  Ju-Mei LU ,  Ming-Li HSU ,  Chun-Chieh WANG

IPC: H01L29/84

CPC classification number: H04R1/04 ,  H04R2201/003

Abstract: A microelectromechanical microphone comprises a shell body, a microelectromechanical microphone chip and an integrated circuit. The shell body having a cavity and an opening, sound from outside enters into the cavity from the opening. The microelectromechanical microphone chip and the integrated circuit are disposed on a circuit layout inside the cavity. A filter is integrated with the microelectromechanical microphone chip at an appropriate location. Sound entered from the opening into the cavity is received by the microelectromechanical microphone chip, then the sound or audio signals are converted to electrical signals through the filter and the integrated circuit, to be transmitted to external electronic devices.

Abstract translation: 微机电麦克风包括壳体，微电机麦克风芯片和集成电路。 具有空腔和开口的壳体，从外部的声音从开口进入空腔。 微电机麦克风芯片和集成电路设置在腔内的电路布局上。 滤波器在适当的位置与微机电麦克风芯片集成。 从开口进入空腔的声音由微机电麦克风芯片接收，然后声音或音频信号通过滤波器和集成电路转换为电信号，传输到外部电子设备。

公开(公告)号：US20090197037A1

公开(公告)日：2009-08-06

申请号：US12026418

申请日：2008-02-05

Applicant: Hung-Jen CHEN

Inventor： Hung-Jen CHEN

IPC: B32B3/06 ,  D04H13/00

CPC classification number: D04H5/03 ,  D04H1/4374 ,  D04H1/492 ,  D04H1/498 ,  Y10T428/24033

Abstract: A method for manufacturing a conductive fabric and products thereof mainly fastens a first soft base and a second soft base with a conductive yarn interposed between them with spaced dot-type fastening spots through a fastening means to facilitate fast production of the conductive fabric. The fastening means could be a needle punching apparatus to provide needle punching on an upper layer fabric and a lower layer fabric without hitting the conductive yarn interposed between them. Thus all three of them can be fastened with the spaced dot-type fastening spots. And the conductive fabric can be produced more efficiently.

Abstract translation: 一种导电性织物的制造方法及其制造方法，主要是通过紧固装置将具有间隔开的点状紧固点插入其间的导电性纱线的第一柔软基材和第二软质基材紧固，以促进导电性织物的快速制造。 紧固装置可以是针刺装置，用于在上层织物和下层织物上提供针刺，而不会在其间插入导电丝。 因此，它们中的所有三个可以用间隔开的点型紧固点紧固。 并且可以更有效地生产导电织物。