公开(公告)号：US11763975B2

公开(公告)日：2023-09-19

申请号：US16441233

申请日：2019-06-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki Kodama ,  Atsushi Ishida ,  Kazuro Nishiwaki

IPC: H01F27/24

CPC classification number: H01F27/24

Abstract: An inductor built-in substrate includes a core substrate having an opening, a magnetic resin body having a through hole and including a magnetic resin filled in the opening of the core substrate, and a plating film formed in the through hole of the magnetic resin body and including an electrolytic plating film such that the electrolytic plating film is formed in contact with the magnetic resin body.

公开(公告)号：US11887767B2

公开(公告)日：2024-01-30

申请号：US17676558

申请日：2022-02-21

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki Kodama ,  Atsushi Ishida ,  Kazuro Nishiwaki

IPC: H01F27/24

CPC classification number: H01F27/24

Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole, a first plating film formed in the first through hole of the core substrate, a magnetic resin body having a second through hole and including a magnetic resin filled in the opening of the core substrate, and a second plating film formed in the second through hole of the magnetic resin body such that the second plating film is formed in contact with the magnetic resin body.

公开(公告)号：US20130219714A1

公开(公告)日：2013-08-29

申请号：US13853087

申请日：2013-03-29

Applicant: IBIDEN CO., LTD.

Inventor： Atsushi Ishida ,  Ryojiro Tominaga ,  Kenji Sakai

IPC: H05K3/40

CPC classification number: H05K3/4038 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49165

Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract translation: 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

公开(公告)号：US20190385777A1

公开(公告)日：2019-12-19

申请号：US16441233

申请日：2019-06-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki Kodama ,  Atsushi Ishida ,  Kazuro Nishiwaki

IPC: H01F27/24

Abstract: An inductor built-in substrate includes a core substrate having an opening, a magnetic resin body having a through hole and including a magnetic resin filled in the opening of the core substrate, and a plating film formed in the through hole of the magnetic resin body and including an electrolytic plating film such that the electrolytic plating film is formed in contact with the magnetic resin body.

公开(公告)号：US09226409B2

公开(公告)日：2015-12-29

申请号：US13853087

申请日：2013-03-29

Applicant: IBIDEN CO., LTD.

Inventor： Atsushi Ishida ,  Ryojiro Tominaga ,  Kenji Sakai

IPC: H05K3/32 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49165

Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract translation: 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。