公开(公告)号：US20170303394A1

公开(公告)日：2017-10-19

申请号：US15487652

申请日：2017-04-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroyuki NISHIOKA ,  Katsuya Takagi ,  Hiroaki Uno ,  Satoru Katada

IPC: H05K1/09 ,  B32B37/14 ,  H05K3/46 ,  B32B7/02 ,  B32B15/20 ,  H05K1/03

CPC classification number: H05K1/09 ,  B32B7/02 ,  B32B15/20 ,  B32B37/14 ,  B32B37/144 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/538 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/032 ,  H05K3/3452 ,  H05K3/38 ,  H05K3/4644

Abstract: A printed wiring board includes a laminated base material including a surface conductor layer, a conductor layer, an interlayer insulating layer interposed between the surface conductor layer and the conductor layer, and an internal bonding layer interposed between the interlayer insulating layer and the surface conductor layer and/or conductor layer, and a solder resist layer laminated on a surface of the laminated base material such that the solder resist layer is covering the surface conductor layer. The internal bonding layer has a surface in contact with the interlayer insulating layer such that the surface of the internal bonding layer has arithmetic average roughness Ra in a range of 100 nm or more and 300 nm or less, and the surface conductor layer has a surface on a solder resist layer side such that the surface of the surface conductor layer has arithmetic average roughness Ra of less than 100 nm.