公开(公告)号：US12279368B2

公开(公告)日：2025-04-15

申请号：US17823210

申请日：2022-08-30

Applicant: IBIDEN CO., LTD.

Inventor： Satoru Kawai ,  Katsuhiko Tanno ,  Susumu Kagohashi ,  Kentaro Wada

IPC: H05K1/03 ,  G06T7/00 ,  H05K3/46

Abstract: A printed wiring board includes a resin insulating layer including resin and particles, and a conductor layer formed on a surface of the resin insulating layer. The particles in the resin insulating layer include first particles and second particles such that the first particles are partially embedded in the resin and the second particles are completely embedded in the resin, and the resin insulating layer is formed such that the first particles has exposed surfaces exposed from the resin and covered surfaces covered by the resin, respectively, the surface of the resin insulating layer includes the first exposed surfaces, and a ratio of a second area to a first area is in a range of 0.1 to 0.25 where the first area is an area of the surface of the resin insulating layer, and the second area is obtained by summing areas of the exposed surfaces of the first particles.

公开(公告)号：US12193156B2

公开(公告)日：2025-01-07

申请号：US17730283

申请日：2022-04-27

Applicant: IBIDEN CO., LTD.

Inventor： Tomoyuki Ikeda ,  Kentaro Wada

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/40

Abstract: A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer, and a coating film formed on a surface of the conductor layer such that the coating film is adhering the conductor layer and the second insulating layer. The conductor layer includes a conductor pad and a wiring pattern, and the conductor pad of the conductor layer has a mounting surface including a first region and a component mounting region formed such that the second insulating layer has a through hole exposing the component mounting region and that the first region is covered by the second insulating layer and roughened to have a surface roughness higher than a first surface roughness of a surface of the wiring pattern facing the second insulating layer.

公开(公告)号：US11363719B2

公开(公告)日：2022-06-14

申请号：US17184761

申请日：2021-02-25

Applicant: IBIDEN CO., LTD.

Inventor： Hiroyasu Noto ,  Kentaro Wada

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/02

Abstract: A wiring substrate includes a core substrate, and a build-up part laminated on the substrate and including resin insulating layers. The insulating layers include a first insulating layer, the build-up part includes a conductor layer on the first insulating layer, a second insulating layer on the first insulating layer and covering the conductor layer, and a recess penetrating through the second insulating layer and exposing portion of the conductor layer such that the conductor layer includes component mounting region that places an electronic component in the recess and a conductor pad forming bottom surface of the recess, the insulating layers include inorganic filler such that all insulating layers or all insulating layers other than the first insulating layer include the inorganic filler and that inorganic filler content rate of the first insulating layer is lower than inorganic filler content rate of the insulating layers other than the first insulating layer.