公开(公告)号：US20160081190A1

公开(公告)日：2016-03-17

申请号：US14851789

申请日：2015-09-11

Applicant: IBIDEN CO., LTD.

Inventor： Yasushi INAGAKI ,  Atsushi KONDO ,  Hiroyuki NISHIOKA ,  Noritaka YAMASHITA

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/02

CPC classification number: H05K3/3452 ,  H05K3/4007 ,  H05K2203/0577 ,  H05K2203/0594

Abstract: A printed wiring board includes a resin insulation layer, a conductive layer formed on a surface of the resin insulation layer and including NSMD pads, and a solder-resist layer formed on the resin insulation layer and having openings such that the openings are exposing the NSMD pads, respectively. The solder-resist layer includes a lower solder-resist layer formed on the surface of the resin insulation layer and an upper solder-resist layer formed on the lower solder-resist layer, and each of the openings has a lower opening portion formed in the lower solder-resist layer and an upper opening portion formed in the upper solder-resist layer such that the upper opening portion has a size which is greater than a size of the lower opening portion.

Abstract translation: 印刷电路板包括树脂绝缘层，形成在树脂绝缘层的表面上并且包括NSMD焊盘的导电层，以及形成在树脂绝缘层上的具有开口使得开口暴露于NSMD的开口的阻焊层 垫片。 阻焊层包括形成在树脂绝缘层的表面上的下阻焊层和形成在下阻焊层上的上阻焊层，并且每个开口具有形成在下阻焊层中的下开口部 下部阻焊层和形成在上部阻焊层中的上部开口部，使得上部开口部的尺寸大于下部开口部的尺寸。