公开(公告)号：US20160255721A1

公开(公告)日：2016-09-01

申请号：US15149768

申请日：2016-05-09

Applicant: ICHIA TECHNOLOGIES,INC.

Inventor： CHIEN-HWA CHIU ,  CHIH-MIN CHAO ,  PEIR-RONG KUO ,  CHIA-HUA CHIANG ,  CHIH-CHENG HSIAO ,  FENG-PING KUAN ,  YING-WEI LEE ,  WEI-CHENG LEE

IPC: H05K1/11 ,  H05K1/09 ,  C23C18/16 ,  H05K3/06 ,  H05K3/38 ,  H05K3/42 ,  H05K1/03 ,  H05K3/18

CPC classification number: H05K1/115 ,  C23C18/16 ,  C23C28/021 ,  C23C28/023 ,  C23C28/32 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/111 ,  H05K1/118 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/381 ,  H05K3/426 ,  H05K3/46 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/05 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A printed circuit board precursor includes a substrate, a catalytic layer, a conductive layer, and a metal layer. The substrate has a top surface, a bottom surface, and a wall defining a channel, and the channel completely penetrates through the substrate from the top surface to the bottom surface. The catalytic layer is formed on the top surface, the bottom surface, and the wall of the substrate. The conductive layer is attached to and covers the catalytic layer. The metal layer is disposed on the conductive layers and filled in the channel.

Abstract translation: 印刷电路板前体包括基板，催化层，导电层和金属层。 衬底具有顶表面，底表面和限定通道的壁，并且通道从顶表面到底表面完全穿透衬底。 催化层形成在基板的顶表面，底表面和壁上。 导电层附着并覆盖催化层。 金属层设置在导电层上并填充在通道中。