公开(公告)号：US20030057192A1

公开(公告)日：2003-03-27

申请号：US10278786

申请日：2002-10-24

Applicant: IMRA America, Inc.

Inventor： Rajesh S. Patel

IPC: B23K026/38 ,  B23K026/14

CPC classification number: B23K26/0676 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/142 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/56

Abstract: A method for material processing using a pulsed laser includes generating a beam of laser pulses, focusing the beam in a plane above the surface of a workpiece, causing breakdown of matter at a lasing point, and removing or modifying material of the workpiece. Positioning the focal plane of the laser above the workpiece permits the use of higher intensity laser beam pulses and minimizes ill effects of workpiece surface conditions on laser energy absorption. In a second aspect, a method for material processing further includes using vacuum to remove the material removed by the beam, preferably by a push-pull type air vacuum system located slightly above the workpiece surface, thereby providing cleaner workpiece and feature surfaces.