-
公开(公告)号：US20230348683A1
公开(公告)日：2023-11-02
申请号：US17949694
申请日：2022-09-21
Inventor： Dong Weon LEE , Yuyan LIU
CPC classification number: C08J7/044 , C08K7/06 , C12N5/0657 , C08J2383/04 , C08K2201/001 , C08K2201/011
Abstract: Disclosed are a conductive polymer substrate and a method for manufacturing the same, wherein the conductive polymer substrate has improved cell alignment, maturity, adhesion, and connectivity by having nanopatterns on a surface thereof while having electric conductivity through embedded silver nanowires (AgNWs).
Search Results
1
records
(took 0.013 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
