公开(公告)号：US20170012375A1

公开(公告)日：2017-01-12

申请号：US15204270

申请日：2016-07-07

Applicant: INGENICO GROUP

Inventor： Stephane PAVAGEAU

IPC: H01R12/70 ,  H01R43/24 ,  G06K7/00 ,  H01R43/16

CPC classification number: H01R12/7076 ,  G06K7/0021 ,  H01R13/03 ,  H01R13/2442 ,  H01R43/16 ,  H01R43/24

Abstract: The technology relates to a secured integrated circuit connector. More particularly, the technology relates to a connection strip for an integrated circuit connector, comprising a contact zone for the reading of an integrated circuit. According to the technology, said connection strip comprises at least one electrically insulated zone.

Abstract translation: 该技术涉及一种安全集成电路连接器。 更具体地，该技术涉及用于集成电路连接器的连接条，其包括用于读取集成电路的接触区域。 根据该技术，所述连接条包括至少一个电绝缘区。

公开(公告)号：US20170061274A1

公开(公告)日：2017-03-02

申请号：US15248505

申请日：2016-08-26

Applicant: INGENICO GROUP

Inventor： Stephane PAVAGEAU

IPC: G06K19/077

CPC classification number: G06K19/07743 ,  G06K19/077 ,  G06K19/0772

Abstract: A card has: a substrate of ID-1 format according to the ISO 7810 standard; and at least one electronic component arranged on the substrate, all or part of said at least one electronic component being disposed in at least one of the two embossing regions defined in the ISO 7811-1 standard as regions in which embossed characters can be formed on the substrate; an encapsulation of the unit comprising the substrate and said at least one electronic component; such that the thickness of the card at the level of said embossing regions does not exceed 1.32 mm.

Abstract translation: 卡具有：根据ISO 7810标准的ID-1格式的基板; 以及布置在基板上的至少一个电子部件，所有或部分所述至少一个电子部件被布置在ISO 7811-1标准中限定的两个压印区域中的至少一个中，作为可以在其上形成压印字符的区域 基材; 包括所述基板和所述至少一个电子部件的单元的封装; 使得在所述压印区域的水平处的卡的厚度不超过1.32mm。