公开(公告)号：US20160141237A1

公开(公告)日：2016-05-19

申请号：US14541803

申请日：2014-11-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Mukta G. FAROOQ ,  William F. LANDERS ,  Jin LIU ,  Andrew J. MARTIN ,  Kathryn E. SCHLICHTING ,  Melissa A. SMITH

IPC: H01L23/498 ,  H05K3/00 ,  H05K3/42 ,  H01L21/48 ,  H05K1/03

CPC classification number: H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/0017 ,  H05K3/007 ,  H05K3/423 ,  H05K2201/10378 ,  H05K2203/0733 ,  H05K2203/143 ,  H05K2203/1461 ,  H01L2924/00

Abstract: A three-dimensional organic structure or glass interposer structure and methods of manufacture are disclosed. The method includes forming lined metal vias in a substrate. The method further includes removing the substrate, leaving the lined metal vias. The method further includes forming a new substrate about the lined metal vias. The method also includes connecting the lined metal vias to wiring layers using back end of the line processes.

Abstract translation: 公开了三维有机结构或玻璃内插器结构及其制造方法。 该方法包括在衬底中形成衬里的金属通孔。 该方法还包括去除衬底，留下衬里的金属通孔。 该方法还包括围绕衬里的金属通孔形成新的衬底。 该方法还包括使用线路工艺的后端将衬里金属通孔连接到布线层。