公开(公告)号：US11492519B2

公开(公告)日：2022-11-08

申请号：US17274390

申请日：2019-06-18

Applicant: IPI TECH INC

Inventor： Kye Ung Lee ,  Ju Hwan Chun ,  Ho Young Park ,  Tae Seok Lee

IPC: B32B27/28 ,  C09J7/38 ,  B32B7/027 ,  B32B27/08 ,  B32B27/20 ,  H01L21/683

Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.