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公开(公告)号：US20160262287A1
公开(公告)日：2016-09-08
申请号：US15155787
申请日：2016-05-16
Applicant: ICEOTOPE LIMITED
Inventor： Daniel CHESTER , Peter HOPTON , Jason BENT , Keith DEAKIN
CPC classification number: H05K7/20281 , B65B7/00 , B65B63/08 , F25D23/12 , G06F1/20 , G06F2200/201 , H01L23/473 , H05K7/20 , H05K7/20218 , H05K7/20236 , H05K7/20263 , H05K7/2039 , H05K7/20509 , H05K7/20763 , H05K7/20772 , H05K7/20781 , H05K13/00 , Y10T29/49002 , Y10T29/4935
Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.
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公开(公告)号：US20160286693A1
公开(公告)日：2016-09-29
申请号：US15179257
申请日：2016-06-10
Applicant: Iceotope Limited
Inventor： Daniel CHESTER , Peter HOPTON , Jason BENT , Keith DEAKIN
IPC: H05K7/20
CPC classification number: H05K7/20281 , B65B7/00 , B65B63/08 , F25D23/12 , G06F1/20 , G06F2200/201 , H01L23/473 , H05K7/20 , H05K7/20218 , H05K7/20236 , H05K7/20263 , H05K7/2039 , H05K7/20509 , H05K7/20763 , H05K7/20772 , H05K7/20781 , H05K13/00 , Y10T29/49002 , Y10T29/4935
Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.
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公开(公告)号：US20170150649A1
公开(公告)日：2017-05-25
申请号：US15416854
申请日：2017-01-26
Applicant: ICEOTOPE LIMITED
Inventor： Daniel CHESTER , Peter HOPTON , Jason BENT , Keith DEAKIN
IPC: H05K7/20
CPC classification number: H05K7/20281 , B65B7/00 , B65B63/08 , F25D23/12 , G06F1/20 , G06F2200/201 , H01L23/473 , H05K7/20 , H05K7/20218 , H05K7/20236 , H05K7/20263 , H05K7/2039 , H05K7/20509 , H05K7/20763 , H05K7/20772 , H05K7/20781 , H05K13/00 , Y10T29/49002 , Y10T29/4935
Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.
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