公开(公告)号：US11622445B2

公开(公告)日：2023-04-04

申请号：US17125329

申请日：2020-12-17

Applicant: Iljin Materials Co., Ltd.

Inventor： Sang Hwa Yoon ,  Chang Yol Yang ,  Jung Woo Seo ,  Young Ho Ryu ,  Kideok Song ,  Eun Sil Choi ,  Won Jin Beom ,  Hyung Cheol Kim

IPC: B32B15/08 ,  C25D3/38 ,  H05K1/09 ,  H05K3/38 ,  B32B15/20 ,  C25D7/00 ,  H05K1/02

Abstract: Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 μm to about 0.5 μm and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.

公开(公告)号：US11166378B2

公开(公告)日：2021-11-02

申请号：US16477669

申请日：2018-01-15

Applicant: Iljin Materials Co., Ltd.

Inventor： Won Jin Beom ,  Sun Hyung Lee ,  Eun Sil Choi ,  Ki Deok Song ,  Hyung Cheol Kim

IPC: B32B15/00 ,  H05K3/02 ,  B32B7/06 ,  B32B15/01 ,  B32B15/20

Abstract: The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, a Cu-diffusion prevention layer, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A2) having peeling properties, and a second metal (B2) and third metal (C2) facilitating the plating of the first metal (A2).

公开(公告)号：US20210195737A1

公开(公告)日：2021-06-24

申请号：US17125329

申请日：2020-12-17

Applicant: Iljin Materials Co., Ltd.

Inventor： Sang Hwa Yoon ,  Chang Yol Yang ,  Jung Woo Seo ,  Young Ho Ryu ,  Kideok Song ,  Eun Sil Choi ,  Won Jin Beom ,  Hyung Cheol Kim

IPC: H05K1/09 ,  H05K3/38 ,  B32B15/08 ,  B32B15/20 ,  C25D7/00 ,  C25D3/38

Abstract: Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 μm to about 0.5 μm and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.

公开(公告)号：US11917755B2

公开(公告)日：2024-02-27

申请号：US16477653

申请日：2018-01-15

Applicant: Iljin Materials Co., Ltd.

Inventor： Won Jin Beom ,  Sun Hyung Lee ,  Eun Sil Choi ,  Ki Deok Song ,  Hyung Cheol Kim

IPC: H05K1/09

CPC classification number: H05K1/09 ,  H05K2201/0338 ,  H05K2201/0355 ,  Y10T428/12431

Abstract: The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, a Cu—Al bonding strength improvement layer, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A3) having peeling properties, and a second metal (B3) and third metal (C3) facilitating the plating of the first metal (A3).

公开(公告)号：US20230189439A1

公开(公告)日：2023-06-15

申请号：US16477653

申请日：2018-01-15

Applicant: Iljin Materials Co., Ltd.

Inventor： Won Jin Beom ,  Sun Hyung Lee ,  Eun Sil Choi ,  Ki Deok Song ,  Hyung Cheol Kim

IPC: H05K1/09

CPC classification number: H05K1/09 ,  H05K2201/0338 ,  H05K2201/0355

Abstract: The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, a Cu—Al bonding strength improvement layer, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A3) having peeling properties, and a second metal (B3) and third metal (C3) facilitating the plating of the first metal (A3).

公开(公告)号：US11164831B2

公开(公告)日：2021-11-02

申请号：US16477701

申请日：2018-01-15

Applicant: Iljin Materials Co., Ltd.

Inventor： Won Jin Beom ,  Sun Hyung Lee ,  Eun Sil Choi ,  Ki Deok Song ,  Hyung Cheol Kim

IPC: B32B15/00 ,  H01L23/00 ,  B32B15/01 ,  B32B15/20 ,  C23C14/16 ,  C23C14/34 ,  C25D3/38 ,  C25D3/44 ,  H01L21/48 ,  H01L23/498

Abstract: The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A1) having peeling properties, and a second metal (B1) and third metal (C1) facilitating the plating of the first metal (A1).