TEMPORARY PLATING MASK FOR METAL ETCHING
    1.
    发明公开

    公开(公告)号:US20240360580A1

    公开(公告)日:2024-10-31

    申请号:US18643598

    申请日:2024-04-23

    Inventor: Paul Blair

    CPC classification number: C25D5/022 C25D5/34 C25D3/04

    Abstract: Manufacturers, particularly manufacturers of parts for aerospace applications, may use a plating mask. Plating masks may be used to mask a metallic part during etching and plating. The present disclosure describes a temporary plating mask that may comprise a hydrocarbon resin and a styrene block copolymer. The temporary plating mask may further comprise a tackifier and other additives such as pigments, fillers, dyes, surfactants, or rheology modifiers.

    SOLUTIONS FOR SOLVENT SWELLING AND SOLVENT BONDING

    公开(公告)号:US20220325052A1

    公开(公告)日:2022-10-13

    申请号:US17713997

    申请日:2022-04-05

    Abstract: The present disclosure is generally directed to solvent mixtures for swelling and bonding polymeric substances for use in facilitating the connection of polymeric substances to other parts. A swelling solvent solution according to the present disclosure may comprise between 5% and 95% by volume n-Octane and between 5% and 95% by volume of either a heptane isomer (such as n-Heptane) or a nonane isomer (such as n-Nonane). The swelling solvent solution may be used to swell polymeric parts to enable the parts to be attached to other parts. A bonding solvent solution according to the present disclosure may comprise between 2% and 98% by volume of at least one of: acetone, MEK, heptane, octane, nonane, isohexane, and THF, and between 2% and 98% by volume cyclohexanone. The bonding solvent solution may be used to bond polymeric parts to other parts.

    VAPOR PHASE SOLVENT PLATING MASK REMOVER
    3.
    发明公开

    公开(公告)号:US20240360390A1

    公开(公告)日:2024-10-31

    申请号:US18643617

    申请日:2024-04-23

    Inventor: Paul Blair

    Abstract: Manufacturers, particularly manufacturers of parts for aerospace applications, may use a plating mask to mask parts when plating. Plating masks may be used to mask a metallic part during etching and plating. After etching and plating, the plating mask needs to be removed. The present disclosure describes a solvent blend for removing a plating mask that comprises a co-solvent and a vapor phase cleaning solvent, wherein the co-solvent has a higher boiling point than the vapor phase cleaning solvent. In some embodiments, the co-solvent comprises isopropyl myristate. In some embodiments, the vapor phase cleaning solvent comprises a mixture of trans-1,2-dichloroethylene and hydrofluoroether.

    PORTABLE, SELF-CONTAINED FIBER OPTIC CLEANING TOOL
    5.
    发明申请
    PORTABLE, SELF-CONTAINED FIBER OPTIC CLEANING TOOL 有权
    便携式,自含光纤清洁工具

    公开(公告)号:US20160199894A1

    公开(公告)日:2016-07-14

    申请号:US14977034

    申请日:2015-12-21

    CPC classification number: B21B45/02 G02B6/3866

    Abstract: A fiber optic component cleaning device includes a body, a feed spool mounted for rotation in the body, a take-up spool mounted for one-way rotation in the body and a central support assembly. A plunger is mounted for movement in the central support assembly and a drive is operably connected to the take-up spool and to the plunger. A cleaning material is wound onto and fed from the feed spool and to the take-up spool. A reservoir assembly is mountable to the body to apply a cleaning solution to the cleaning material.

    Abstract translation: 光纤部件清洁装置包括主体,安装成用于在主体中旋转的进给卷轴,安装成用于主体中的单向旋转的卷取卷轴和中心支撑组件。 安装柱塞以在中心支撑组件中移动,并且驱动器可操作地连接到卷取卷轴和柱塞。 清洁材料被卷绕并从进料卷轴和卷取卷轴进给。 储存器组件可安装到主体以将清洁溶液施加到清洁材料上。

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