公开(公告)号：US20210380404A1

公开(公告)日：2021-12-09

申请号：US17412160

申请日：2021-08-25

Applicant: Industrial Technology Research Institute

Inventor： Heng-Chung CHANG ,  Jhih-Jie HUANG ,  Chih-Ya TSAI ,  Jing-Yuan LIN

IPC: B81C1/00

Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.

公开(公告)号：US20210188626A1

公开(公告)日：2021-06-24

申请号：US16726025

申请日：2019-12-23

Applicant: Industrial Technology Research Institute

Inventor： Heng-chung CHANG ,  Jhih-Jie HUANG ,  Chih-Ya TSAI ,  Jing-Yuan LIN

IPC: B81B7/00 ,  B81C1/00

Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.