公开(公告)号：US09406572B2

公开(公告)日：2016-08-02

申请号：US14527811

申请日：2014-10-30

Applicant: Infineon Technologies AG

Inventor： Rudolf Zelsacher ,  Peter Irsigler ,  Erich Griebl ,  Manfred Pirker ,  Andreas Moser

IPC: H01L21/66 ,  H01L21/28 ,  H01L29/66 ,  H01L21/768 ,  H01L21/02

CPC classification number: H01L22/14 ,  H01L21/28158 ,  H01L22/34 ,  H01L29/66568 ,  H01L29/94

Abstract: According to various embodiments, a method for processing a substrate may include: forming a dielectric layer over the substrate, the dielectric layer may include a plurality of test regions; forming an electrically conductive layer over the dielectric layer to contact the dielectric layer in the plurality of test regions; simultaneously electrically examining the dielectric layer in the plurality of test regions, wherein portions of the electrically conductive layer contacting the dielectric layer in the plurality of test regions are electrically conductively connected with each other by an electrically conductive material; and separating the electrically conductive layer into portions of the electrically conductive layer contacting the dielectric layer in the plurality of test regions from each other.

Abstract translation: 根据各种实施例，用于处理衬底的方法可以包括：在衬底上形成电介质层，电介质层可以包括多个测试区域; 在所述电介质层上形成导电层以接触所述多个测试区域中的介电层; 同时对多个测试区域中的电介质层进行电学检查，其中与多个测试区域中的电介质层接触的导电层的部分通过导电材料彼此导电连接; 以及将所述导电层分离成所述多个测试区域中与所述电介质层接触的所述导电层的部分。

公开(公告)号：US20160126149A1

公开(公告)日：2016-05-05

申请号：US14527811

申请日：2014-10-30

Applicant: Infineon Technologies AG

Inventor： Rudolf Zelsacher ,  Peter Irsigler ,  Erich Griebl ,  Manfred Pirker ,  Andreas Moser

IPC: H01L21/66 ,  H01L21/02 ,  H01L21/768 ,  H01L21/28 ,  H01L29/66

CPC classification number: H01L22/14 ,  H01L21/28158 ,  H01L22/34 ,  H01L29/66568 ,  H01L29/94

Abstract: According to various embodiments, a method for processing a substrate may include: forming a dielectric layer over the substrate, the dielectric layer may include a plurality of test regions; forming an electrically conductive layer over the dielectric layer to contact the dielectric layer in the plurality of test regions; simultaneously electrically examining the dielectric layer in the plurality of test regions, wherein portions of the electrically conductive layer contacting the dielectric layer in the plurality of test regions are electrically conductively connected with each other by an electrically conductive material; and separating the electrically conductive layer into portions of the electrically conductive layer contacting the dielectric layer in the plurality of test regions from each other.

Abstract translation: 根据各种实施例，用于处理衬底的方法可以包括：在衬底上形成电介质层，电介质层可以包括多个测试区域; 在所述电介质层上形成导电层以接触所述多个测试区域中的介电层; 同时对多个测试区域中的电介质层进行电学检查，其中与多个测试区域中的电介质层接触的导电层的部分通过导电材料彼此导电连接; 以及将所述导电层分离成所述多个测试区域中与所述电介质层接触的所述导电层的部分。