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公开(公告)号:US20210310890A1
公开(公告)日:2021-10-07
申请号:US17348940
申请日:2021-06-16
Applicant: Infineon Technologies AG
Inventor: Emanuel STOICESCU , Matthias BOEHM , Stefan JAHN , Erhard LANDGRAF , Michael WEBER , Janis WEIDENAUER
IPC: G01L19/14 , H01L23/053 , G01L19/00 , H01L21/56 , H01L23/24 , H01L23/495 , H01L23/60 , H01L23/00
Abstract: A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.
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公开(公告)号:US20220174440A1
公开(公告)日:2022-06-02
申请号:US17518108
申请日:2021-11-03
Applicant: Infineon Technologies AG
Inventor: Victor POPESCU-STROE , Matthias BOEHM
Abstract: A method includes providing a first data channel configured for a transmission of acoustic data between a first microphone and a controller, providing a second data channel configured for a transmission of acoustic data between a second microphone and the controller, and transmitting non-acoustic data generated by the first microphone via the second data channel.
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公开(公告)号:US20220225021A1
公开(公告)日:2022-07-14
申请号:US17552817
申请日:2021-12-16
Applicant: Infineon Technologies AG
Inventor: Victor POPESCU-STROE , Matthias BOEHM
IPC: H04R3/00 , H04R1/40 , G10L21/0216
Abstract: A microphone device includes a number N of at least two serially coupled microphones forming a microphone chain. The microphones are configured to transmit data to a controller via the microphone chain. The microphone chain is configured to output time-multiplexed data transmitted by the microphones.
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公开(公告)号:US20190113412A1
公开(公告)日:2019-04-18
申请号:US16159918
申请日:2018-10-15
Applicant: Infineon Technologies AG
Inventor: Emanuel STOICESCU , Matthias BOEHM , Stefan JAHN , Erhard LANDGRAF , Michael WEBER , Janis WEIDENAUER
Abstract: A pressure sensor device includes a semiconductor die of the pressure sensor device and a bond wire of the pressure sensor device. A maximal vertical distance between a part of the bond wire and the semiconductor die is larger than a minimal vertical distance between the semiconductor die and a surface of a gel covering the semiconductor die.
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公开(公告)号:US20190250059A1
公开(公告)日:2019-08-15
申请号:US16271090
申请日:2019-02-08
Applicant: Infineon Technologies AG
Inventor: Victor POPESCU-STROE , Emanuel STOICESCU , Matthias BOEHM , Constantin CRISU , Uwe FAKESCH , Stefan JAHN , Erhard LANDGRAF , Janis WEIDENAUER , Bernhard WINKLER
CPC classification number: G01L27/005 , G01L19/04
Abstract: Examples provide for an apparatus, method, and computer program for comparing the output of sensor cells in an arrangement of sensor cells in an area A, including a set of at least two measurement units. A measurement unit includes at least two sensor cells, wherein at least one sensor cell of at least one measurement unit includes a sensitive sensor cell, which is sensitive with respect to a measured quantity. The sensor cells are intermixed with each other. The apparatus further includes means for selecting output signals of sensor cells of the arrangement and means for determining a measured quantity or determining an intact sensor cell by comparing output signals of different measurement units.
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