公开(公告)号：US20250054842A1

公开(公告)日：2025-02-13

申请号：US18792118

申请日：2024-08-01

Applicant: Infineon Technologies AG

Inventor： Rowel TABAJONDA ,  Michael STADLER ,  Aira Lourdes Baring VILLAMOR ,  Mei Yih GOH ,  Juliane JUNESCH ,  Chee Voon TAN ,  Mei Qi TAY

IPC: H01L23/495 ,  H01L23/00

Abstract: A package including a component for a package is disclosed. In one example, wherein the component comprises a functional body, and a wettability layer arranged on a main surface of the functional body and configured for promoting wetting of a connection medium to be applied on the wettability layer for connecting the component with a further component of the package. The wettability layer has a lateral circumference at least part of which having a concave edge.

公开(公告)号：US20230420317A1

公开(公告)日：2023-12-28

申请号：US18211898

申请日：2023-06-20

Applicant: Infineon Technologies AG

Inventor： Michael STADLER ,  Thomas BEMMERL

IPC: H01L23/16 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H05K3/34 ,  B23K1/00

CPC classification number: H01L23/16 ,  H01L23/49575 ,  H01L23/3107 ,  H01L23/49503 ,  H01L21/56 ,  H05K3/3431 ,  B23K1/0016 ,  B23K2101/42

Abstract: An electronic device and method is disclosed. In one example, the electronic device includes a solderable surface and at least one surface opening arranged in the solderable surface. The electronic device further includes an encapsulation material, encapsulating at least one electronic component of the electronic device, and at least one vent opening arranged in an area of the surface opening and extending through the encapsulation material.