公开(公告)号：US10539779B2

公开(公告)日：2020-01-21

申请号：US15674149

申请日：2017-08-10

Applicant: Infineon Technologies AG

Inventor： Ludwig Heitzer ,  Derek Debie ,  Klaus Elian ,  Cyrus Ghahremani ,  Johannes Lodermeyer ,  Oskar Neuhoff ,  Johann Strasser

IPC: G02B26/08 ,  B81B7/00 ,  B81C3/00 ,  G02B26/10 ,  G01S7/481

Abstract: A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.

公开(公告)号：US10571682B2

公开(公告)日：2020-02-25

申请号：US15674149

申请日：2017-08-10

Applicant: Infineon Technologies AG

Inventor： Ludwig Heitzer ,  Derek Debie ,  Klaus Elian ,  Cyrus Ghahremani ,  Johannes Lodermeyer ,  Oskar Neuhoff ,  Johann Strasser

IPC: G02B26/08 ,  B81B7/00 ,  B81C3/00 ,  G02B26/10 ,  G01S7/481

Abstract: A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.