公开(公告)号：US10241088B2

公开(公告)日：2019-03-26

申请号：US15136469

申请日：2016-04-22

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Gottfried Beer ,  Sebastian Beer ,  Alfons Dehe ,  Franz Jost ,  Stefan Kolb ,  Guenther Ruhl ,  Rainer Markus Schaller

IPC: G01N29/24 ,  G01N29/032

Abstract: A photo-acoustic gas sensor includes a light emitter unit having a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and a wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit having a microphone. The light emitter unit is arranged so that the beam of light pulses traverses an area configured to accommodate the gas. The detector unit is arranged so that the microphone can receive a signal oscillating with the repetition frequency.

公开(公告)号：US09952110B2

公开(公告)日：2018-04-24

申请号：US15084232

申请日：2016-03-29

Applicant: Infineon Technologies AG

Inventor： Sebastian Beer ,  Horst Theuss

IPC: G01F1/68 ,  G01L9/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  G01F15/14

CPC classification number: G01L9/0041 ,  G01F15/14 ,  G01L19/14 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3157 ,  H01L23/4952 ,  H01L23/49811 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A pressure sensor package includes a pressure sensor having a first side attached to a substrate and a second side opposite the first side, the first side having a pressure inlet aligned with an opening in the substrate, the second side having one or more electrical contacts. A logic die attached to an opposite side of the substrate as the pressure sensor is operable to process signals from the pressure sensor. First electrical conductors connect to the one or more electrical contacts of the pressure sensor. Second electrical conductors connect to one or more electrical contacts of the logic die. A mold compound completely encapsulates the second electrical conductors and at least partly encapsulates the logic die and the first electrical conductors. An open passage in the mold compound is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package.

公开(公告)号：US20160313288A1

公开(公告)日：2016-10-27

申请号：US15136469

申请日：2016-04-22

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Gottfried Beer ,  Sebastian Beer ,  Alfons Dehe ,  Franz Jost ,  Stefan Kolb ,  Guenther Ruhl ,  Rainer Markus Schaller

IPC: G01N29/24 ,  G01N29/02

CPC classification number: G01N29/2425 ,  G01N29/032 ,  G01N2291/021

Abstract: A photo-acoustic gas sensor includes a light emitter unit having a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and a wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit having a microphone. The light emitter unit is arranged so that the beam of light pulses traverses an area configured to accommodate the gas. The detector unit is arranged so that the microphone can receive a signal oscillating with the repetition frequency.

Abstract translation: 光声气体传感器包括光发射器单元，其具有光发射器，其被配置为发射具有预定重复频率和对应于待感测气体的吸收带的波长的光脉冲束，以及具有麦克风的检测器单元 。 光发射器单元布置成使得光束脉冲穿过配置成容纳气体的区域。 检测器单元布置成使得麦克风可以接收以重复频率振荡的信号。

公开(公告)号：US20170284880A1

公开(公告)日：2017-10-05

申请号：US15084232

申请日：2016-03-29

Applicant: Infineon Technologies AG

Inventor： Sebastian Beer ,  Horst Theuss

IPC: G01L9/00 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: G01L9/0041 ,  G01F15/14 ,  G01L19/14 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3157 ,  H01L23/4952 ,  H01L23/49811 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A pressure sensor package includes a pressure sensor having a first side attached to a substrate and a second side opposite the first side, the first side having a pressure inlet aligned with an opening in the substrate, the second side having one or more electrical contacts. A logic die attached to an opposite side of the substrate as the pressure sensor is operable to process signals from the pressure sensor. First electrical conductors connect to the one or more electrical contacts of the pressure sensor. Second electrical conductors connect to one or more electrical contacts of the logic die. A mold compound completely encapsulates the second electrical conductors and at least partly encapsulates the logic die and the first electrical conductors. An open passage in the mold compound is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package.

公开(公告)号：US20160282212A1

公开(公告)日：2016-09-29

申请号：US14667858

申请日：2015-03-25

Applicant: Infineon Technologies AG

Inventor： Sebastian Beer ,  Helmut Wietschorke ,  Jochen Dangelmaier ,  Horst Theuss ,  Bernhard Knott ,  Thomas Mueller ,  Andreas Allmeier

IPC: G01L19/14 ,  H01L25/18 ,  H01L21/52 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: G01L19/147 ,  G01L19/0084 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49586 ,  H01L25/18 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012

Abstract: A molded semiconductor package includes a substrate having opposing first and second main surfaces, a semiconductor die attached to the first main surface of the substrate, an adhesion adapter attached to the second main surface of the substrate or a surface of the semiconductor die facing away from the substrate, and a mold compound encapsulating the semiconductor die, the adhesion adapter and at least part of the substrate. The adhesion adapter is configured to adapt adhesion properties of the mold compound to adhesion properties of the substrate or semiconductor die to which the adhesion adapter is attached, such that the mold compound more strongly adheres to the adhesion adapter than directly to the substrate or semiconductor die to which the adhesion adapter is attached. The adhesion adapter has a surface feature which strengthens the adhesion between the adhesion adapter and the mold compound.

Abstract translation: 模制的半导体封装包括具有相对的第一和第二主表面的基板，附接到基板的第一主表面的半导体管芯，附接到基板的第二主表面的粘合适配器或半导体管芯的远离 衬底和封装半导体管芯，粘合适配器和至少部分衬底的模具化合物。 粘合适配器被配置成使得模制化合物的粘合性能适应于粘合适配器所附着的基底或半导体管芯的粘合性能，使得模制化合物比直接连接到基底或半导体模具更强烈地粘附到粘合适配器 附着适配器附接到该装置。 粘合适配器具有加强粘合适配器和模具化合物之间的粘附的表面特征。

公开(公告)号：US09013013B1

公开(公告)日：2015-04-21

申请号：US14098585

申请日：2013-12-06

Applicant: Infineon Technologies AG

Inventor： Sebastian Beer ,  Helmut Wietschorke ,  Jochen Dangelmaier ,  Horst Theuss

IPC: H01L29/84 ,  G01L19/00 ,  H01L25/00

CPC classification number: G01L19/0069 ,  G01L19/141 ,  H01L23/24 ,  H01L23/3135 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/371 ,  H01L2224/40145 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the pressure sensor has a first side attached to the second side of the pressure sensor and a second side opposite the first side with electrical contacts. The logic die is laterally offset from the electrical contacts of the pressure sensor and operable to process signals from the pressure sensor. Electrical conductors connect the electrical contacts of the pressure sensor to the electrical contacts of the logic die. Molding compound encapsulates the pressure sensor, the logic die and the electrical conductors, and has an opening defining an open passage to the pressure sensor port. External electrical contacts are provided at a side of the pressure sensor package.

Abstract translation: 压力传感器组件包括压力传感器，该压力传感器具有第一侧，其具有压力传感器端口，与第一侧相对的第二侧和电触头。 堆叠在压力传感器上的逻辑管芯具有附接到压力传感器的第二侧的第一侧和具有电触点的与第一侧相对的第二侧。 逻辑管芯从压力传感器的电触头侧向偏移并可操作以处理来自压力传感器的信号。 电导体将压力传感器的电触点连接到逻辑管芯的电触头。 成型复合物封装压力传感器，逻辑管芯和电导体，并且具有限定到压力传感器端口的开放通道的开口。 外部电触头设置在压力传感器封装的一侧。