公开(公告)号：US20210302671A1

公开(公告)日：2021-09-30

申请号：US17215728

申请日：2021-03-29

Applicant: Infinera Corp.

Inventor： Franklin Wall, JR. ,  John Osenbach ,  Jiaming Zhang

IPC: G02B6/42

Abstract: Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.