公开(公告)号：US12043011B2

公开(公告)日：2024-07-23

申请号：US17463893

申请日：2021-09-01

Applicant: InnoLux Corporation

Inventor： Cheng-Wei Liu ,  Fang-Cheng Jhou ,  Cheng-Chun Zhou

IPC: B32B17/00 ,  B32B1/00 ,  B32B7/00 ,  B32B7/12 ,  B32B17/10 ,  B32B37/00 ,  B32B37/06 ,  B32B37/10 ,  B32B38/00 ,  B32B38/16 ,  C03C27/00 ,  C03C27/10

CPC classification number: B32B17/10853 ,  B32B1/00 ,  B32B7/12 ,  B32B17/10981 ,  B32B37/003 ,  B32B37/06 ,  B32B37/1009 ,  B32B38/162 ,  C03C27/10 ,  B32B2250/02 ,  B32B2457/20

Abstract: An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; attaching an adhesive member onto the first substrate; and performing a curve attaching step, so that the first substrate and the second substrate are attached to each other through the adhesive member to form a curved composite component, wherein the curve attaching step is performed at a temperature of 20 degrees Celsius to 160 degrees Celsius.