公开(公告)号：US12219843B2

公开(公告)日：2025-02-04

申请号：US18608837

申请日：2024-03-18

Applicant: InnoLux Corporation

Inventor： Ya-Wen Lin ,  Chien-Chih Chen ,  Yen-Hsi Tu ,  Cheng-Wei Chang ,  Shu-Hui Yang

IPC: H10K59/18 ,  H01L23/498 ,  H01L27/15 ,  H10K77/10 ,  H10K102/00

Abstract: An electronic device includes a conductive wire having a metal portion with openings. The openings include a first opening and a second opening arranged along a first direction, and the metal portion includes the first to fourth extending portions and the first to fourth joint portions. The first opening is surrounded by the first extending portion, the second extending portion, the first joint portion, and the second joint portion. The second opening is surrounded by the third extending portion, the fourth extending portion, the third joint portion, and the fourth joint portion. Along the first direction, a ratio of a first width sum of widths of the first extending portion, the second extending portion, the third extending portion, and the fourth extending portion to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.

公开(公告)号：US20250133927A1

公开(公告)日：2025-04-24

申请号：US19007591

申请日：2025-01-02

Applicant: InnoLux Corporation

Inventor： Ya-Wen Lin ,  Chien-Chih Chen ,  Yen-Hsi Tu ,  Cheng-Wei Chang ,  Shu-Hui Yang

IPC: H10K59/18 ,  H01L23/498 ,  H10H29/14 ,  H10K77/10 ,  H10K102/00

Abstract: An electronic device includes a flexible substrate and a conductive wire structure. The conductive wire structure is disposed on the flexible substrate and includes a first segment, a second segment, a third segment, a fourth segment, a first joint portion, a second joint portion, a third joint portion and a fourth joint portion. A first opening is surrounded by the first segment, the second segment, the first joint portion and the second joint portion. A second opening is surrounded by the third segment, the fourth segment, the third joint portion and the fourth joint portion. Along a first direction, a ratio of a first width sum of widths of the first segment, the second segment, the third segment and the fourth segment to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.

公开(公告)号：US11968869B2

公开(公告)日：2024-04-23

申请号：US17732500

申请日：2022-04-28

Applicant: InnoLux Corporation

Inventor： Ya-Wen Lin ,  Chien-Chih Chen ,  Yen-Hsi Tu ,  Cheng-Wei Chang ,  Shu-Hui Yang

IPC: H10K59/18 ,  H01L23/498 ,  H01L27/15 ,  H10K77/10 ,  H10K102/00

CPC classification number: H10K59/18 ,  H01L23/4985 ,  H01L27/156 ,  H10K77/111 ,  H10K2102/311

Abstract: An electronic device includes a flexible substrate and a conductive wire. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. The metal portion includes a plurality of extending portions and a plurality of joint portions, and each of the openings is surrounded by two of the plurality of extending portions and two of the plurality of joint portions. A ratio of a sum of widths of the plurality of extending portions to a sum of widths of the plurality of joint portions is in a range from 0.8 to 1.2.

公开(公告)号：US20220254867A1

公开(公告)日：2022-08-11

申请号：US17732500

申请日：2022-04-28

Applicant: InnoLux Corporation

Inventor： Ya-Wen Lin ,  Chien-Chih Chen ,  Yen-Hsi Tu ,  Cheng-Wei Chang ,  Shu-Hui Yang

IPC: H01L27/32 ,  H01L23/498 ,  H01L27/15 ,  H01L51/00

Abstract: An electronic device includes a flexible substrate and a conductive wire. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. The metal portion includes a plurality of extending portions and a plurality of joint portions, and each of the openings is surrounded by two of the plurality of extending portions and two of the plurality of joint portions. A ratio of a sum of widths of the plurality of extending portions to a sum of widths of the plurality of joint portions is in a range from 0.8 to 1.2.

公开(公告)号：US11348993B2

公开(公告)日：2022-05-31

申请号：US16656537

申请日：2019-10-17

Applicant: InnoLux Corporation

Inventor： Ya-Wen Lin ,  Chien-Chih Chen ,  Yen-Hsi Tu ,  Cheng-Wei Chang ,  Shu-Hui Yang

IPC: H01L51/52 ,  H01L27/32 ,  H01L23/498 ,  H01L27/15 ,  H01L51/00

Abstract: An electronic device includes a flexible substrate and a conductive wire. The flexible substrate includes a first bending region and a side region connected to the first bending region. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. A ratio of a total width of the metal portion disposed in the first bending region to a total width of the metal portion disposed in the side region is in a range from 0.8 to 1.2, and a length of one of the openings in the first bending region is less than or equal to a length of one of the openings in the side region.

公开(公告)号：US20200161412A1

公开(公告)日：2020-05-21

申请号：US16656537

申请日：2019-10-17

Applicant: InnoLux Corporation

Inventor： Ya-Wen Lin ,  Chien-Chih Chen ,  Yen-Hsi Tu ,  Cheng-Wei Chang ,  Shu-Hui Yang

IPC: H01L27/32 ,  H01L27/15 ,  H01L23/498 ,  H01L51/00

Abstract: An electronic device includes a flexible substrate and a conductive wire. The flexible substrate includes a first bending region and a side region connected to the first bending region. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. A ratio of a total width of the metal portion disposed in the first bending region to a total width of the metal portion disposed in the side region is in a range from 0.8 to 1.2, and a length of one of the openings in the first bending region is less than or equal to a length of one of the openings in the side region.

公开(公告)号：US20240224681A1

公开(公告)日：2024-07-04

申请号：US18608837

申请日：2024-03-18

Applicant: InnoLux Corporation

Inventor： Ya-Wen Lin ,  Chien-Chih Chen ,  Yen-Hsi Tu ,  Cheng-Wei Chang ,  Shu-Hui Yang

IPC: H10K59/18 ,  H01L23/498 ,  H01L27/15 ,  H10K77/10 ,  H10K102/00

CPC classification number: H10K59/18 ,  H01L23/4985 ,  H01L27/156 ,  H10K77/111 ,  H10K2102/311

Abstract: An electronic device includes a conductive wire having a metal portion with openings. The openings include a first opening and a second opening arranged along a first direction, and the metal portion includes the first to fourth extending portions and the first to fourth joint portions. The first opening is surrounded by the first extending portion, the second extending portion, the first joint portion, and the second joint portion. The second opening is surrounded by the third extending portion, the fourth extending portion, the third joint portion, and the fourth joint portion. Along the first direction, a ratio of a first width sum of widths of the first extending portion, the second extending portion, the third extending portion, and the fourth extending portion to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.