公开(公告)号：US11361998B2

公开(公告)日：2022-06-14

申请号：US16904659

申请日：2020-06-18

Applicant: InnoLux Corporation

Inventor： I-Chang Liang ,  Chien-Lin Lin ,  Chin-Lung Ting

IPC: H01L21/71 ,  H01L21/78 ,  H01L23/544

Abstract: A method for manufacturing an electronic device is provided. The method includes the following steps: providing a first mother substrate including a plurality of first substrate areas; performing a first half-cutting step on the first mother substrate to produce a first crack to define the plurality of first substrate areas; disposing a first optical film on the first mother substrate having the first crack, wherein the first optical film has a first cutting region corresponding to the first crack; performing a first cutting step in the first cutting region of the first optical film; and separating the plurality of first substrate areas to form a plurality of first substrates.