公开(公告)号：US20220254282A1

公开(公告)日：2022-08-11

申请号：US17727816

申请日：2022-04-25

Applicant: InnoLux Corporation

Inventor： Hsin-Hao Huang ,  Chu-Hong Lai ,  Yu-Chih Tseng

IPC: G09F9/30 ,  G02F1/1333 ,  H05K1/18

Abstract: The present disclosure provides a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

公开(公告)号：US20220113579A1

公开(公告)日：2022-04-14

申请号：US17555492

申请日：2021-12-19

Applicant: InnoLux Corporation

Inventor： Hsin-Hao Huang ,  Chu-Hong Lai

IPC: G02F1/1333 ,  G02F1/1335

Abstract: A manufacturing method of an electronic device is provided. First, a mother panel including a first flexible mother board, a second flexible mother board and at least one sealing material is provided, and the sealing material is disposed between the first flexible mother board and the second flexible mother board. Then, a separating process including a laser-cutting process is performed to cut the first flexible mother board into a first flexible substrate and to cut the second flexible mother board into a second flexible substrate. The first flexible substrate includes a first laser-cutting buffer region and a first edge. The second flexible substrate includes a second laser-cutting buffer region and a second edge. The sealing material is away from the first edge by the first laser-cutting buffer region and away from the second edge by the second laser-cutting buffer region.

公开(公告)号：US20210263376A1

公开(公告)日：2021-08-26

申请号：US17151651

申请日：2021-01-18

Applicant: InnoLux Corporation

Inventor： Hsin-Hao Huang ,  Tzu-Yi Lin ,  Chu-Hong Lai

IPC: G02F1/1335 ,  G02F1/13357

Abstract: A flexible display device having a bending region is provided by the present disclosure. The flexible display device includes a display panel, a first polarizer and a second polarizer disposed under the display panel. The first polarizer is disposed on the display panel and includes a first conductive layer and a first optical layer, wherein the first conductive layer is disposed between the first optical layer and the display panel.

公开(公告)号：US20210255499A1

公开(公告)日：2021-08-19

申请号：US17151644

申请日：2021-01-18

Applicant: InnoLux Corporation

Inventor： Ming-Han Wu ,  Chien-Feng Li ,  Hsin-Hao Huang ,  Chu-Hong Lai

IPC: G02F1/1333 ,  G02F1/1368

Abstract: The present disclosure provides an electronic device including a first flexible substrate, a second flexible substrate, a liquid crystal layer and a supporting structure. The second flexible substrate includes a first region and a second region. The first region overlaps with the first flexible substrate, and the second region does not overleap with the first flexible substrate. The liquid crystal layer is disposed between the first flexible substrate and the second flexible substrate. The supporting structure is disposed on the second region and includes a supporting film.

公开(公告)号：US11645953B2

公开(公告)日：2023-05-09

申请号：US17727816

申请日：2022-04-25

Applicant: InnoLux Corporation

Inventor： Hsin-Hao Huang ,  Chu-Hong Lai ,  Yu-Chih Tseng

IPC: G02F1/1333 ,  G09F9/30 ,  H05K1/18

CPC classification number: G09F9/301 ,  G02F1/133305 ,  H05K1/189 ,  H05K2201/0332 ,  H05K2201/10136

Abstract: The present disclosure provides a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

公开(公告)号：US11348489B2

公开(公告)日：2022-05-31

申请号：US17099805

申请日：2020-11-17

Applicant: InnoLux Corporation

Inventor： Hsin-Hao Huang ,  Chu-Hong Lai ,  Yu-Chih Tseng

IPC: G09F9/30 ,  H05K1/18 ,  G02F1/1333

Abstract: The present disclosure provides a flexible display device and a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

公开(公告)号：US20210264822A1

公开(公告)日：2021-08-26

申请号：US17148511

申请日：2021-01-13

Applicant: InnoLux Corporation

Inventor： Toshiya Inada ,  Yu-Chih Tseng ,  Hsin-Hao Huang ,  Chu-Hong Lai ,  Cheng-Jen Chu

IPC: G09F9/30 ,  G02F1/1333 ,  G02F1/1339 ,  G02F1/13363 ,  G02F1/1335

Abstract: A reflective flexible display device includes a liquid crystal layer disposed between a first flexible substrate and a second flexible substrate, and a reflective pixel electrode disposed on the first flexible substrate. A CIELAB b* coordinate of the second flexible substrate is less than or equal to a CIELAB b* coordinate of the first flexible substrate.

公开(公告)号：US20210192985A1

公开(公告)日：2021-06-24

申请号：US17099805

申请日：2020-11-17

Applicant: InnoLux Corporation

Inventor： Hsin-Hao Huang ,  Chu-Hong Lai ,  Yu-Chih Tseng

IPC: G09F9/30 ,  G02F1/1333 ,  H05K1/18

Abstract: The present disclosure provides a flexible display device and a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

公开(公告)号：US20210181563A1

公开(公告)日：2021-06-17

申请号：US17113124

申请日：2020-12-07

Applicant: InnoLux Corporation

Inventor： Hsin-Hao Huang ,  Chu-Hong Lai

IPC: G02F1/1333 ,  G02F1/1335

Abstract: An electronic device and a manufacturing method thereof are disclosed in the present disclosure. The electronic device comprises a first flexible substrate, a second flexible substrate and a sealing material. The first flexible substrate comprises a first laser-cutting buffer region, and the first flexible substrate comprises a first edge. The second flexible substrate comprises a second laser-cutting buffer region, and the second flexible substrate comprises a second edge. The sealing material is disposed between the first flexible substrate and the second flexible substrate. The sealing material is away from the first edge by the first laser-cutting buffer region and the sealing material is away from the second edge by the second laser-cutting buffer region. Therefore, the cracking of the sealing material can be reduced.

公开(公告)号：US20210063802A1

公开(公告)日：2021-03-04

申请号：US16984122

申请日：2020-08-03

Applicant: InnoLux Corporation

Inventor： Hsin-Hao Huang ,  Yu-Chih Tseng ,  Chu-Hong Lai

IPC: G02F1/1345 ,  G02F1/1333 ,  G02F1/1335

Abstract: An electronic device includes a first flexible substrate, a bonding pad and a first supporting film. The bonding pad is disposed on the first flexible substrate, and a first supporting film is attached to the first flexible substrate. The first supporting film has a first opening corresponding to the bonding pad.