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公开(公告)号：US11510321B2
公开(公告)日：2022-11-22
申请号：US17188554
申请日：2021-03-01
Applicant: InnoLux Corporation
Inventor： Wei-Cheng Chu , Chia-Cheng Liu , Ming-Fu Jiang
Abstract: An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.
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公开(公告)号：US11837592B2
公开(公告)日：2023-12-05
申请号：US17827944
申请日：2022-05-30
Applicant: InnoLux Corporation
Inventor： Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Chih-Yuan Lee
IPC: H01L25/16 , H01L33/58 , H01L25/075 , H01L33/62 , H01L33/52
CPC classification number: H01L25/167 , H01L25/0753 , H01L33/58 , H01L33/52 , H01L33/62 , H01L2933/005 , H01L2933/0033 , H01L2933/0066
Abstract: A device includes a substrate having a first surface and a second surface opposite to the first surface; a thin-film transistor array disposed on the first surface, including a plurality of transistors; a plurality of diodes disposed on the thin-film transistor array; a plurality of conductive structures penetrating through the substrate from the first surface to the second surface, wherein the plurality of conductive structures are corresponding to the plurality of diodes and electrically connected to the plurality of diodes; a driver unit disposed on the second surface of the substrate; a patterned conductive layer disposed between the substrate and the driver unit; a protection layer disposed on the patterned conductive layer, wherein the protection layer has an opening that exposes the patterned conductive layer; and a conductive material disposed in the opening.
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公开(公告)号：US10672829B2
公开(公告)日：2020-06-02
申请号：US16209998
申请日：2018-12-05
Applicant: Innolux Corporation
Inventor： Wei-Cheng Chu , Ming-Fu Jiang , Gu-Jhong Jhang
IPC: H01L29/18 , H01L27/15 , H01L33/44 , H01L25/075 , H01L33/62
Abstract: The disclosure provides a manufacturing method of an LED display device, including the following steps: providing a substrate; forming at least one first bonding pad and at least one second bonding pad on the substrate; forming at least one spacer on the substrate, wherein the spacer is located between the first bonding pad and the second bonding pad, and a height of the spacer is P μm; providing a conductive paste layer above the substrate, wherein the conductive paste layer includes a plurality of conductive particles; and bonding at least one LED on the substrate, wherein the LED includes a first electrode and a second electrode, and the first electrode and the second electrode have a height H μm. The first electrode and the second electrode of the LED are respectively electrically connected to the first bonding pad and the second bonding pad of the substrate through the conductive particles of the conductive paste layer, and H+3.5 μm≥P μm≥H+0.48 μM.
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公开(公告)号：US11380661B2
公开(公告)日：2022-07-05
申请号：US16902463
申请日：2020-06-16
Applicant: InnoLux Corporation
Inventor： Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Chih-Yuan Lee
IPC: H01L25/16 , H01L33/58 , H01L25/075 , H01L33/62 , H01L33/52
Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.
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Patent Agency Ranking
公开(公告)号：US10720415B2
公开(公告)日：2020-07-21
申请号：US15698777
申请日：2017-09-08
Applicant: InnoLux Corporation
Inventor： Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Chih-Yuan Lee
IPC: H01L25/16 , H01L33/58 , H01L25/075 , H01L33/62 , H01L33/52
Abstract: A display device is provided. The display device includes a substrate having a first surface and a second surface opposite to the first surface, a plurality of light-emitting units disposed on the first surface of the substrate, and a plurality of conductive structures extending into the substrate from the second surface of the substrate. The plurality of conductive structures are electrically connected to the plurality of light-emitting units.
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公开(公告)号：US20190109174A1
公开(公告)日：2019-04-11
申请号：US16209998
申请日：2018-12-05
Applicant: Innolux Corporation
Inventor： Wei-Cheng Chu , Ming-Fu Jiang , Gu-Jhong Jhang
IPC: H01L27/15 , H01L25/075 , H01L33/44 , H01L33/62
CPC classification number: H01L27/156 , H01L25/0753 , H01L33/44 , H01L33/62 , H01L2933/0066
Abstract: The disclosure provides a manufacturing method of an LED display device, including the following steps: providing a substrate; forming at least one first bonding pad and at least one second bonding pad on the substrate; forming at least one spacer on the substrate, wherein the spacer is located between the first bonding pad and the second bonding pad, and a height of the spacer is P μm; providing a conductive paste layer above the substrate, wherein the conductive paste layer includes a plurality of conductive particles; and bonding at least one LED on the substrate, wherein the LED includes a first electrode and a second electrode, and the first electrode and the second electrode have a height H μm. The first electrode and the second electrode of the LED are respectively electrically connected to the first bonding pad and the second bonding pad of the substrate through the conductive particles of the conductive paste layer, and H+3.5 μm≥P μm≥H+0.48 μM.
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公开(公告)号：US10825787B2
公开(公告)日：2020-11-03
申请号：US16148253
申请日：2018-10-01
Applicant: InnoLux Corporation
Inventor： Wei-Cheng Chu , Ming-Fu Jiang , Chia-Cheng Liu , Tong-Jung Wang
Abstract: A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 μm and less than or equal to 14 μm. In addition, the disclosure further provides an electronic device including the first electronic element.
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公开(公告)号：US10186548B2
公开(公告)日：2019-01-22
申请号：US15678128
申请日：2017-08-16
Applicant: Innolux Corporation
Inventor： Wei-Cheng Chu , Ming-Fu Jiang , Gu-Jhong Jhang
IPC: H01L27/15 , H01L33/44 , H01L25/075 , H01L33/62
Abstract: The disclosure provides an LED display device including a substrate, at least one first bonding pad and at least one second bonding pad, at least one spacer, at least one LED, and a conductive paste layer. The first and the second bonding pads are disposed on the substrate. The spacer is located between the first and the second bonding pads, wherein a height of the spacer is P μm. The LED is disposed on the substrate and includes a first electrode and a second electrode. The first and the second electrodes have a height H μm. The conductive paste layer is located between the substrate and the LED and includes a plurality of conductive particles. The first and the second electrodes are respectively electrically connected to the first and the second bonding pads through the conductive particles, and H+3.5 μm≥P μm≥H+0.48 μm.
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公开(公告)号：US20180053808A1
公开(公告)日：2018-02-22
申请号：US15678128
申请日：2017-08-16
Applicant: Innolux Corporation
Inventor： Wei-Cheng Chu , Ming-Fu Jiang , Gu-Jhong Jhang
CPC classification number: H01L27/156 , H01L25/0753 , H01L33/44 , H01L33/62 , H01L2933/0066
Abstract: The disclosure provides an LED display device including a substrate, at least one first bonding pad and at least one second bonding pad, at least one spacer, at least one LED, and a conductive paste layer. The first and the second bonding pads are disposed on the substrate. The spacer is located between the first and the second bonding pads, wherein a height of the spacer is P μm. The LED is disposed on the substrate and includes a first electrode and a second electrode. The first and the second electrodes have a height H μm. The conductive paste layer is located between the substrate and the LED and includes a plurality of conductive particles. The first and the second electrodes are respectively electrically connected to the first and the second bonding pads through the conductive particles, and H+3.5 μm≧P μm≧H+0.48 μm.
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