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公开(公告)号：US20220173000A1
公开(公告)日：2022-06-02
申请号：US17519540
申请日：2021-11-04
Applicant: Innolux Corporation
Inventor： Yeong-E Chen , Bi-Ly Lin , Kuang Chiang Huang , Yu Ting Liu
Abstract: The embodiments of the disclosure provide a manufacturing method of a package circuit, including the following steps. A circuit structure including a plurality of conductive pads is formed. A liquid crystal layer is formed on the circuit structure. An inspection step is performed, and the inspection step includes determining the conductivity of the conductive pads according to the result of the rotation of a liquid crystal layer oriented with an electric field. In addition, the liquid crystal layer is removed.
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