公开(公告)号：US11803085B2

公开(公告)日：2023-10-31

申请号：US17727840

申请日：2022-04-25

Applicant: Innolux Corporation

Inventor： Shu-Han Yang ,  Hui-Min Huang ,  Chia-Min Yeh

IPC: G02F1/1339 ,  G02F1/1333 ,  G02F1/1341

CPC classification number: G02F1/13394 ,  G02F1/1341 ,  G02F1/133345

Abstract: The electronic device includes a first substrate, a second substrate, a first support member, a planarization layer, and an alignment layer. The second substrate is opposite to the first substrate. The first support member is disposed in the peripheral region and located between the first substrate and the second substrate. The planarization layer is disposed on the first substrate and has a first portion and an opening. The first portion is disposed between the opening, and the first support member and the first portion are overlapped in a normal direction of the first substrate. The alignment layer is disposed on the planarization layer. The alignment layer on the first portion has a first thickness. The alignment layer in the opening has a second thickness. The first thickness is greater than or equal to zero and less than the second thickness.

公开(公告)号：US20220252922A1

公开(公告)日：2022-08-11

申请号：US17727840

申请日：2022-04-25

Applicant: Innolux Corporation

Inventor： Shu-Han Yang ,  Hui-Min Huang ,  Chia-Min Yeh

IPC: G02F1/1339 ,  G02F1/1333 ,  G02F1/1341

Abstract: The electronic device includes a first substrate, a second substrate, a first support member, a planarization layer, and an alignment layer. The second substrate is opposite to the first substrate. The first support member is disposed in the peripheral region and located between the first substrate and the second substrate. The planarization layer is disposed on the first substrate and has a first portion and an opening. The first portion is disposed between the opening, and the first support member and the first portion are overlapped in a normal direction of the first substrate. The alignment layer is disposed on the planarization layer. The alignment layer on the first portion has a first thickness. The alignment layer in the opening has a second thickness. The first thickness is greater than or equal to zero and less than the second thickness.

公开(公告)号：US20240012294A1

公开(公告)日：2024-01-11

申请号：US18474221

申请日：2023-09-26

Applicant: Innolux Corporation

Inventor： Shu-Han Yang ,  Hui-Min Huang ,  Chia-Min Yeh

IPC: G02F1/1339 ,  G02F1/1333 ,  G02F1/1341

CPC classification number: G02F1/13394 ,  G02F1/133345 ,  G02F1/1341

Abstract: The electronic device includes a first substrate, a second substrate, a first support member, a planarization layer, and an alignment layer. The second substrate is opposite to the first substrate. The first support member is disposed in the peripheral region and located between the first substrate and the second substrate. The planarization layer is disposed on the first substrate and has a first portion and an opening. The first portion is disposed between the opening, and the first support member and the first portion are overlapped in a normal direction of the first substrate. The alignment layer is disposed on the planarization layer. The alignment layer on the first portion has a first thickness. The alignment layer in the opening has a second thickness. The first thickness is greater than or equal to zero and less than the second thickness.

公开(公告)号：US20210124200A1

公开(公告)日：2021-04-29

申请号：US17033693

申请日：2020-09-26

Applicant: Innolux Corporation

Inventor： Shu-Han Yang ,  Hui-Min Huang ,  Chia-Min Yeh

IPC: G02F1/1339 ,  G02F1/1341 ,  G02F1/1333

Abstract: The electronic device includes a first substrate, a second substrate, a first support member, a planarization layer, and an alignment layer. The second substrate is opposite to the first substrate. The first support member is disposed in the peripheral region and located between the first substrate and the second substrate. The planarization layer is disposed on the first substrate and has a first portion and an opening. The first portion is disposed between the opening, and the first support member and the first portion are overlapped in a normal direction of the first substrate. The alignment layer is disposed on the planarization layer. The alignment layer on the first portion has a first thickness. The alignment layer in the opening has a second thickness. The first thickness is greater than or equal to zero and less than the second thickness.

公开(公告)号：US11347113B2

公开(公告)日：2022-05-31

申请号：US17033693

申请日：2020-09-26

Applicant: Innolux Corporation

Inventor： Shu-Han Yang ,  Hui-Min Huang ,  Chia-Min Yeh

IPC: G02F1/1339 ,  G02F1/1333 ,  G02F1/1341

Abstract: The electronic device includes a first substrate, a second substrate, a first support member, a planarization layer, and an alignment layer. The second substrate is opposite to the first substrate. The first support member is disposed in the peripheral region and located between the first substrate and the second substrate. The planarization layer is disposed on the first substrate and has a first portion and an opening. The first portion is disposed between the opening, and the first support member and the first portion are overlapped in a normal direction of the first substrate. The alignment layer is disposed on the planarization layer. The alignment layer on the first portion has a first thickness. The alignment layer in the opening has a second thickness. The first thickness is greater than or equal to zero and less than the second thickness.