ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

    公开(公告)号:US20240402551A1

    公开(公告)日:2024-12-05

    申请号:US18656537

    申请日:2024-05-06

    Abstract: An electronic device including a substrate and a plurality of control units is provided. The plurality of control units are disposed on the substrate, wherein each of the plurality of control units includes a transistor, an insulating layer, a first conductive layer, and a second conductive layer. The transistor includes a first electrode. The insulating layer is disposed on the transistor and has a through hole exposing the first electrode. The first conductive layer is disposed on the transistor, wherein a portion of the first conductive layer is overlapped with the insulating layer, and another portion of the first conductive layer is electrically connected to the first electrode via the through hole. The second conductive layer is at least partially overlapped with the first conductive layer and in direct contact with the first conductive layer. The electronic device provided by the disclosure has improved transmittance and yield.

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