公开(公告)号：US10483177B2

公开(公告)日：2019-11-19

申请号：US15638704

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Bassam Ziadeh ,  John Lofgren ,  Santosh Pabba ,  Kevin Pounds ,  Alin Ila

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H05K13/00

Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.

公开(公告)号：US10681851B2

公开(公告)日：2020-06-09

申请号：US15629908

申请日：2017-06-22

Applicant: Intel Corporation

Inventor： Bassam Mohammed Ziadeh ,  Alin Ila ,  Nathan P. Heckathorne

IPC: B23P19/00 ,  H05K13/04 ,  G01R31/26 ,  H05K3/32 ,  B25J15/00 ,  B25J15/06 ,  G01R31/28 ,  H01L21/67 ,  H01L21/683

Abstract: Described herein are pick and place devices having reconfigurable nozzle subassemblies, as well as related devices and methods. In some embodiments, a pick and place device may have a reusable base plate, and a plurality of reusable vacuum nozzle subassemblies that are removably coupled to the base plate in a first configuration. In some embodiments, plurality of vacuum nozzle subassemblies may be removed, then removably re-coupled to the base plate in a second configuration. In some embodiments, a pick and place device may include a base plate, a plurality of nozzle subassemblies removably attached to the base plate, where individual nozzle subassemblies include a vacuum nozzle, a vacuum connection, and a base; and a top plate coupled to the base plate, where the top plate includes a plurality of openings configured to seat the plurality of nozzle subassemblies.

公开(公告)号：US20190006251A1

公开(公告)日：2019-01-03

申请号：US15638704

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Bassam Ziadeh ,  John Lofgren ,  Santosh Pabba ,  Kevin Pounds ,  Alin Ila

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H05K13/00

CPC classification number: H01L23/13 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68309 ,  H01L2221/68313 ,  H05K13/0084

Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.