公开(公告)号：US20210127529A1

公开(公告)日：2021-04-29

申请号：US17110068

申请日：2020-12-02

Applicant: Intel Corporation

Inventor： Timothy Glen Hanna ,  Suchismita Sarangi ,  Carl D. Williams ,  Jordan Johnson ,  Juan G. Cevallos Palomeque ,  Mark E. Sprenger ,  Peipei Ding ,  Christian Amoah-Kusi ,  Sean T. Sivapalan ,  Rithi S. Soeung ,  Curtis A. Valentine

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a cold plate. The ruler factor cold plate is to receive heat from semiconductor chips of a electronic component that is to be plugged into an electronic system. The cold plate has at least one of: a) a linearly advancing physical interface, the linearly advancing physical interface to make physical contact with a corresponding linearly advancing physical interface of a cooling component of the electronic system, the physical contact to create a thermal path from the cold plate to the cooling component; b) first fingers on a first face of the cold plate to make spring-force thermal contact with the semiconductor chips of the electronic component and second fingers on an opposite second face of the cold plate to make spring-force thermal contact with the respective semiconductor chips of another, neighboring electronic component.