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公开(公告)号：US11153968B2
公开(公告)日：2021-10-19
申请号：US15841880
申请日：2017-12-14
Applicant: Intel Corporation
Inventor： Jackson Chung Peng Kong , Bok Eng Cheah , Khang Choong Yong , Yun Ling , Chia Voon Tan
Abstract: Techniques and mechanisms for mitigating the effect of signal noise on communication via an interconnect. In an embodiment, a substrate includes an interconnect and a conductor which has a hole formed therein. Portions of the interconnect variously extend over a side of the conductor, wherein another recess portion of the interconnect extends from a plane which includes the side, and further extends at least partially into the hole. The configuration of the recess portion extending within the hole may contribute to an impedance which dampens a transmitter slew rate of the communication. In an embodiment, a total distance along a path formed by the interconnect is equal to or less than 5.5 inches.
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公开(公告)号：US20190045625A1
公开(公告)日：2019-02-07
申请号：US15841880
申请日：2017-12-14
Applicant: Intel Corporation
Inventor： Jackson Chung Peng Kong , Bok Eng Cheah , Khang Choong Yong , Yun Ling , Chia Voon Tan
Abstract: Techniques and mechanisms for mitigating the effect of signal noise on communication via an interconnect. In an embodiment, a substrate includes an interconnect and a conductor which has a hole formed therein. Portions of the interconnect variously extend over a side of the conductor, wherein another recess portion of the interconnect extends from a plane which includes the side, and further extends at least partially into the hole. The configuration of the recess portion extending within the hole may contribute to an impedance which dampens a transmitter slew rate of the communication. In an embodiment, a total distance along a path formed by the interconnect is equal to or less than 5.5 inches.
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